JPH06508886A - 回転円筒状マグネトロンのためのカンチレバー装着部 - Google Patents
回転円筒状マグネトロンのためのカンチレバー装着部Info
- Publication number
- JPH06508886A JPH06508886A JP3513100A JP51310091A JPH06508886A JP H06508886 A JPH06508886 A JP H06508886A JP 3513100 A JP3513100 A JP 3513100A JP 51310091 A JP51310091 A JP 51310091A JP H06508886 A JPH06508886 A JP H06508886A
- Authority
- JP
- Japan
- Prior art keywords
- drive shaft
- bearing housing
- bearing
- vacuum
- cylindrical magnetron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
- Sealing Of Bearings (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
- Earth Drilling (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
Abstract
Description
Claims (25)
- 1.真空チャンバ内に円筒状マグネトロンを回転自在に装着するための装置であ って、 その一方端が前記真空チャンバ内に伸びかつ他方端が前記真空チャンバの外側に 位置する軸受ハウジングと、前記軸受ハウジング内に回転自在に装着され、各端 部が前記軸受ハウジングを越えて伸びる駆動軸を含み、前記駆動軸が前記真空チ ャンバ内部の前記駆動軸の端部に前記円筒状マグネトロンを取付けるための手段 を有し、前記軸受ハウジング内に位置し前記軸受ハウジングに対し前記駆動軸を 封止するための真空シール手段を含み、それによりその内部部分が前記真空チャ ンバから分離され、前記円筒状マグネトロンの負荷が前記真空シールに対し伝達 されないように前記軸受ハウジング内に前記駆動軸を回転自在に装着するための 手段とを含む、装置。
- 2.前記軸受ハウジングを冷却するための手段をさらに含む、請求項1に記載の 装置。
- 3.前記冷却手段が前記真空チャンバ内部のその端部で前記軸受ハウジングのま わりに位置する液体冷却暗黒部シールドを含む、請求項2に記載の装置。
- 4.前記回転自在装着手段が前記軸受ハウジング内の前記駆動軸の長さ方向に沿 って間隔決めされた軸受を含む、請求項1に記載の装置。
- 5.前記円筒状マグネトロンに対し電気的接続を行なうための手段をさらに含む 、請求項1に記載の装置。
- 6.前記電気的接続手段が前記駆動軸とこれに電気的接触状態にあるブラシ接続 部を含む、請求項5に記載の装置。
- 7.前記円筒状マグネトロンを前記真空チャンバから電気的に分離するための手 段をさらに含む、請求項6に記載の装置。
- 8.前記電気的分離手段が前記真空チャンバに前記軸受ハウジングを装着するた めのフランジと、前記軸受ハウジングと前記フランジとの間に位置する電気的絶 縁部材とを含む請求項7に記載の装置。
- 9.前記真空チャンバの外側の前記駆動軸の端部上に装着されたプーリをさらに 含む、請求項1に記載の装置。
- 10.前記駆動軸が中空でかつ両端で開いている、請求項9に記載の装置。
- 11.前記駆動軸を経由して前記円筒状マグネトロンに/から冷却液を流すため の手段をさらに含む、請求項10に記載の装置。
- 12.前記流す手段が前記駆動軸を通って延在しかつその内部に支持される取入 管を含む、請求項11に記載の装置。
- 13.前記円筒状マグネトロン内に磁気アレイを支持するための手段をさらに含 む、請求項12に記載の装置。
- 14.前記磁気アレイを支持するための手段が前記取入管である、請求項13に 記載の装置。
- 15.前記円筒状マグネトロンを前記駆動軸に装着するための手段をさらに含む 、請求項14に記載の装置。
- 16.前記装着手段が前記真空チャンバ内部で前記駆動軸のその端部上に装着さ れた第1端部プラグを含む、請求項15に記載の装置。
- 17.前記駆動軸の自由端に装着された第2端部プラグをさらに含む、請求項1 6に記載の装置。
- 18.前記第2端部プラグが前記取入管を回転自在に支持するための手段を含む 、請求項17に記載の装置。
- 19.前記真空シール手段が鉄流体シールである、請求項1に記載の装置。
- 20.回転円筒状マグネトロンを使用する、基板上に薄膜をスパッタするための 装置であって、排出可能コーティングチャンバと、軸受ハウジング、前記軸受ハ ウジング内に装着されて前記円筒状マグネトロンを回転させるための駆動軸、前 記軸受ハウジングの内部の少なくとも一部分を前記コーティングチャンバから分 離するための真空シール、および前記軸受ハウジング内にあって、前記円筒状マ グネトロンの負荷が前記真空シールに伝達されないように、前記駆動軸を回転自 在に支持するための手段を含む、前記コーティングチャンバの壁を介して装着さ れたカンチレバー装着ユニットと、前記円筒状マグネトロンを過ぎて基板を移送 するための手段を含む、装置。
- 21.前記回転自在支持手段が前記軸受ハウジング内の前記駆動軸の長さ方向に 沿って位置する軸受を含む、請求項20に記載の装置。
- 22.前記軸受が、玉軸受、テーパされたローラ軸受、円筒状ローラ軸受および ドローンカップニードルローラ軸受からなるグループから選択される、請求項2 1に記載の装置。
- 23.前記軸受ハウジングを冷却するための手段をさらに含む、請求項21に記 載の装置。
- 24.前記冷却手段が前記コーティングチャンバ内部で、その端部で前記軸受ハ ウジングのまわりに位置する液体冷却された暗黒部シールドを含む、請求項23 に記載の装置。
- 25.前記真空シールが鉄流体シールである、請求項20、21、または23に 記載の装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56621490A | 1990-08-10 | 1990-08-10 | |
US566,214 | 1990-08-10 | ||
US07/737,372 US5200049A (en) | 1990-08-10 | 1991-07-29 | Cantilever mount for rotating cylindrical magnetrons |
PCT/US1991/005300 WO1992002660A1 (en) | 1990-08-10 | 1991-07-31 | Cantilever mount for rotating cylindrical magnetrons |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06508886A true JPH06508886A (ja) | 1994-10-06 |
JP3324654B2 JP3324654B2 (ja) | 2002-09-17 |
Family
ID=27074110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51310091A Expired - Lifetime JP3324654B2 (ja) | 1990-08-10 | 1991-07-31 | 回転円筒状マグネトロンのためのカンチレバー装着部 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5200049A (ja) |
EP (1) | EP0543844B1 (ja) |
JP (1) | JP3324654B2 (ja) |
AT (1) | ATE167705T1 (ja) |
CA (1) | CA2089147C (ja) |
DE (1) | DE69129658T2 (ja) |
DK (1) | DK0543844T3 (ja) |
ES (1) | ES2129027T3 (ja) |
WO (1) | WO1992002660A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009513818A (ja) * | 2003-07-04 | 2009-04-02 | ベーカート・アドヴァンスト・コーティングス | 回転管状スパッタターゲット組立体 |
JP2014194086A (ja) * | 2004-10-18 | 2014-10-09 | Soleras Advanced Coatings Bvba | 回転可能なスパッタリングターゲットを支持する平面エンドブロック |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH690805A5 (de) * | 1993-05-04 | 2001-01-15 | Unaxis Balzers Ag | Magnetfeldunterstützte Zerstäubungsanordnung und Vakuumbehandlungsanlage hiermit. |
US5744017A (en) * | 1993-12-17 | 1998-04-28 | Kabushiki Kaisha Kobe Seiko Sho | Vacuum arc deposition apparatus |
US5567289A (en) * | 1993-12-30 | 1996-10-22 | Viratec Thin Films, Inc. | Rotating floating magnetron dark-space shield and cone end |
US5620577A (en) * | 1993-12-30 | 1997-04-15 | Viratec Thin Films, Inc. | Spring-loaded mount for a rotatable sputtering cathode |
US5571393A (en) * | 1994-08-24 | 1996-11-05 | Viratec Thin Films, Inc. | Magnet housing for a sputtering cathode |
US5445721A (en) * | 1994-08-25 | 1995-08-29 | The Boc Group, Inc. | Rotatable magnetron including a replacement target structure |
US5518592A (en) * | 1994-08-25 | 1996-05-21 | The Boc Group, Inc. | Seal cartridge for a rotatable magnetron |
US5812405A (en) * | 1995-05-23 | 1998-09-22 | Viratec Thin Films, Inc. | Three variable optimization system for thin film coating design |
US5789838A (en) * | 1996-10-09 | 1998-08-04 | Satcon Technology Corporation | Three-axis force actuator for a magnetic bearing |
US6328858B1 (en) * | 1998-10-01 | 2001-12-11 | Nexx Systems Packaging, Llc | Multi-layer sputter deposition apparatus |
US6641701B1 (en) * | 2000-06-14 | 2003-11-04 | Applied Materials, Inc. | Cooling system for magnetron sputtering apparatus |
US6682288B2 (en) | 2000-07-27 | 2004-01-27 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6530733B2 (en) | 2000-07-27 | 2003-03-11 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6821912B2 (en) | 2000-07-27 | 2004-11-23 | Nexx Systems Packaging, Llc | Substrate processing pallet and related substrate processing method and machine |
US6375815B1 (en) * | 2001-02-17 | 2002-04-23 | David Mark Lynn | Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly |
US7399385B2 (en) * | 2001-06-14 | 2008-07-15 | Tru Vue, Inc. | Alternating current rotatable sputter cathode |
US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
US20030173217A1 (en) * | 2002-03-14 | 2003-09-18 | Sputtering Components, Inc. | High-power ion sputtering magnetron |
DE10247051A1 (de) * | 2002-10-09 | 2004-04-22 | Polymer Latex Gmbh & Co Kg | Latex und Verfahren zu seiner Herstellung |
DE10312632B4 (de) * | 2003-03-21 | 2005-11-24 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg | Magnetron mit zweistufiger Dichtung |
DE10312631A1 (de) * | 2003-03-21 | 2004-10-07 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg | Magnetron mit Kühlmittelschutz |
US7100954B2 (en) * | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
SG118232A1 (en) * | 2004-02-27 | 2006-06-27 | Superiorcoat Private Ltd | Cathodic arc coating apparatus |
US20050224343A1 (en) * | 2004-04-08 | 2005-10-13 | Richard Newcomb | Power coupling for high-power sputtering |
US20060049043A1 (en) * | 2004-08-17 | 2006-03-09 | Matuska Neal W | Magnetron assembly |
US20060065524A1 (en) * | 2004-09-30 | 2006-03-30 | Richard Newcomb | Non-bonded rotatable targets for sputtering |
DE602005006008T2 (de) * | 2004-10-18 | 2009-06-18 | Bekaert Advanced Coatings | Endblock für eine sputter-vorrichtung mit drehbarem target |
US20060096855A1 (en) * | 2004-11-05 | 2006-05-11 | Richard Newcomb | Cathode arrangement for atomizing a rotatable target pipe |
DE102004058316A1 (de) * | 2004-12-02 | 2006-06-08 | W.C. Heraeus Gmbh | Rohrförmiges Sputtertarget |
PL1856303T3 (pl) * | 2005-03-11 | 2009-06-30 | Bekaert Advanced Coatings | Pojedynczy, prostokątny blok czołowy |
US20060278524A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for modulating power signals to control sputtering |
US20060278521A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for controlling ion density and energy using modulated power signals |
ATE415503T1 (de) | 2005-08-10 | 2008-12-15 | Applied Materials Gmbh & Co Kg | Vakuumbeschichtungsanlage mit motorisch angetriebener drehkathode |
US7842355B2 (en) * | 2005-11-01 | 2010-11-30 | Applied Materials, Inc. | System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties |
US20070095281A1 (en) * | 2005-11-01 | 2007-05-03 | Stowell Michael W | System and method for power function ramping of microwave liner discharge sources |
WO2007147757A1 (en) * | 2006-06-19 | 2007-12-27 | Bekaert Advanced Coatings | Insert piece for an end-block of a sputtering installation |
CN100564582C (zh) * | 2006-09-19 | 2009-12-02 | 中国科学院合肥物质科学研究院 | 用于10-8Pa超高真空圆形平面磁控溅射靶的密封装置 |
US8535490B2 (en) * | 2007-06-08 | 2013-09-17 | General Plasma, Inc. | Rotatable magnetron sputtering with axially movable target electrode tube |
DE102008018609B4 (de) * | 2008-04-11 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Antriebsendblock für ein rotierendes Magnetron |
US8137517B1 (en) | 2009-02-10 | 2012-03-20 | Wd Media, Inc. | Dual position DC magnetron assembly |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
DE102009056241B4 (de) * | 2009-12-01 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target |
EP2371992B1 (en) * | 2010-04-01 | 2013-06-05 | Applied Materials, Inc. | End-block and sputtering installation |
GB201200574D0 (en) * | 2012-01-13 | 2012-02-29 | Gencoa Ltd | In-vacuum rotational device |
US8674327B1 (en) | 2012-05-10 | 2014-03-18 | WD Media, LLC | Systems and methods for uniformly implanting materials on substrates using directed magnetic fields |
DE102014101344B4 (de) * | 2014-02-04 | 2016-03-31 | Von Ardenne Gmbh | Endblock-Anordnung |
DE102014101582B4 (de) * | 2014-02-07 | 2017-10-26 | Von Ardenne Gmbh | Lagervorrichtung |
DE102014101830B4 (de) * | 2014-02-13 | 2015-10-08 | Von Ardenne Gmbh | Antriebs-Baugruppe, Prozessieranordnung, Verfahren zum Montieren einer Antriebs-Baugruppe und Verfahren zum Demontieren einer Antriebs-Baugruppe |
EA028887B1 (ru) * | 2014-02-28 | 2018-01-31 | Общество С Ограниченной Ответственностью "Изовак" | Система охлаждения мишени магнетронно-распылительного устройства цилиндрического типа |
CN104357802B (zh) * | 2014-11-06 | 2017-03-15 | 深圳市纳为金属技术有限公司 | 一种氟化物轴封超薄旋转阴极端头 |
EP3032565A1 (en) | 2014-12-08 | 2016-06-15 | Soleras Advanced Coatings bvba | A device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target tube using said device or assembly |
EP3032566B1 (en) | 2014-12-08 | 2019-11-06 | Soleras Advanced Coatings bvba | Cylindrical structure for use in an RF sputter process and a sputtering system comprising same |
BE1023876B1 (nl) | 2016-07-13 | 2017-08-31 | Soleras Advanced Coatings Bvba | Elektrische overdracht in een eindblok |
BE1024754B9 (nl) | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
BE1026859B1 (nl) | 2018-10-22 | 2020-07-14 | Soleras Advanced Coatings Bv | Magnetron met geïntegreerd circuit voor het monitoren en controle |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
US4422916A (en) * | 1981-02-12 | 1983-12-27 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4356073A (en) * | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4417968A (en) * | 1983-03-21 | 1983-11-29 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4443318A (en) * | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
US4445997A (en) * | 1983-08-17 | 1984-05-01 | Shatterproof Glass Corporation | Rotatable sputtering apparatus |
US4466877A (en) * | 1983-10-11 | 1984-08-21 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4519885A (en) * | 1983-12-27 | 1985-05-28 | Shatterproof Glass Corp. | Method and apparatus for changing sputtering targets in a magnetron sputtering system |
US4904362A (en) * | 1987-07-24 | 1990-02-27 | Miba Gleitlager Aktiengesellschaft | Bar-shaped magnetron or sputter cathode arrangement |
US5100527A (en) * | 1990-10-18 | 1992-03-31 | Viratec Thin Films, Inc. | Rotating magnetron incorporating a removable cathode |
-
1991
- 1991-07-29 US US07/737,372 patent/US5200049A/en not_active Expired - Lifetime
- 1991-07-31 WO PCT/US1991/005300 patent/WO1992002660A1/en active IP Right Grant
- 1991-07-31 DK DK91914088T patent/DK0543844T3/da active
- 1991-07-31 AT AT91914088T patent/ATE167705T1/de not_active IP Right Cessation
- 1991-07-31 CA CA002089147A patent/CA2089147C/en not_active Expired - Lifetime
- 1991-07-31 JP JP51310091A patent/JP3324654B2/ja not_active Expired - Lifetime
- 1991-07-31 DE DE69129658T patent/DE69129658T2/de not_active Expired - Lifetime
- 1991-07-31 EP EP91914088A patent/EP0543844B1/en not_active Expired - Lifetime
- 1991-07-31 ES ES91914088T patent/ES2129027T3/es not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009513818A (ja) * | 2003-07-04 | 2009-04-02 | ベーカート・アドヴァンスト・コーティングス | 回転管状スパッタターゲット組立体 |
JP2014194086A (ja) * | 2004-10-18 | 2014-10-09 | Soleras Advanced Coatings Bvba | 回転可能なスパッタリングターゲットを支持する平面エンドブロック |
Also Published As
Publication number | Publication date |
---|---|
DE69129658D1 (de) | 1998-07-30 |
DK0543844T3 (da) | 1999-04-06 |
US5200049A (en) | 1993-04-06 |
EP0543844A4 (ja) | 1994-03-09 |
WO1992002660A1 (en) | 1992-02-20 |
CA2089147A1 (en) | 1992-02-11 |
EP0543844A1 (en) | 1993-06-02 |
JP3324654B2 (ja) | 2002-09-17 |
ATE167705T1 (de) | 1998-07-15 |
CA2089147C (en) | 2001-04-17 |
DE69129658T2 (de) | 1999-03-11 |
EP0543844B1 (en) | 1998-06-24 |
ES2129027T3 (es) | 1999-06-01 |
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