JPH06502502A - 位相幾何学的画像の転写用処理方法 - Google Patents
位相幾何学的画像の転写用処理方法Info
- Publication number
- JPH06502502A JPH06502502A JP4500419A JP50041992A JPH06502502A JP H06502502 A JPH06502502 A JP H06502502A JP 4500419 A JP4500419 A JP 4500419A JP 50041992 A JP50041992 A JP 50041992A JP H06502502 A JPH06502502 A JP H06502502A
- Authority
- JP
- Japan
- Prior art keywords
- product
- solvent
- resin
- developer
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims description 6
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000002904 solvent Substances 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 15
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 229920001083 polybutene Polymers 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 239000010410 layer Substances 0.000 description 19
- 230000008569 process Effects 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 5
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 4
- 239000002952 polymeric resin Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 150000003457 sulfones Chemical class 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229940117955 isoamyl acetate Drugs 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- OMOVVBIIQSXZSZ-UHFFFAOYSA-N [6-(4-acetyloxy-5,9a-dimethyl-2,7-dioxo-4,5a,6,9-tetrahydro-3h-pyrano[3,4-b]oxepin-5-yl)-5-formyloxy-3-(furan-3-yl)-3a-methyl-7-methylidene-1a,2,3,4,5,6-hexahydroindeno[1,7a-b]oxiren-4-yl] 2-hydroxy-3-methylpentanoate Chemical compound CC12C(OC(=O)C(O)C(C)CC)C(OC=O)C(C3(C)C(CC(=O)OC4(C)COC(=O)CC43)OC(C)=O)C(=C)C32OC3CC1C=1C=COC=1 OMOVVBIIQSXZSZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9014462A FR2669442B1 (fr) | 1990-11-20 | 1990-11-20 | Procede de transfert d'images topologiques. |
| FR90/14462 | 1990-11-20 | ||
| PCT/FR1991/000894 WO1992009012A1 (fr) | 1990-11-20 | 1991-11-14 | Procede de transfert d'images topologiques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06502502A true JPH06502502A (ja) | 1994-03-17 |
Family
ID=9402386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4500419A Pending JPH06502502A (ja) | 1990-11-20 | 1991-11-14 | 位相幾何学的画像の転写用処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0558666A1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPH06502502A (cg-RX-API-DMAC10.html) |
| KR (1) | KR930703631A (cg-RX-API-DMAC10.html) |
| FR (1) | FR2669442B1 (cg-RX-API-DMAC10.html) |
| TW (1) | TW202503B (cg-RX-API-DMAC10.html) |
| WO (1) | WO1992009012A1 (cg-RX-API-DMAC10.html) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133738A (en) * | 1980-03-25 | 1981-10-20 | Mitsubishi Electric Corp | Forming method for pattern of photomask |
| US4308340A (en) * | 1980-08-08 | 1981-12-29 | American Hoechst Corporation | Aqueous 2-propoxyethanol containing processing composition for lithographic printing plates |
| JPS5872139A (ja) * | 1981-10-26 | 1983-04-30 | Tokyo Ohka Kogyo Co Ltd | 感光性材料 |
| JPS58187926A (ja) * | 1982-04-28 | 1983-11-02 | Toyo Soda Mfg Co Ltd | 放射線ネガ型レジストの現像方法 |
| US4600684A (en) * | 1983-02-10 | 1986-07-15 | Oki Electric Industry Co., Ltd. | Process for forming a negative resist using high energy beam |
| US4535054A (en) * | 1983-05-05 | 1985-08-13 | Hughes Aircraft Company | Wet process for developing styrene polymer resists for submicron lithography |
| EP0211161B1 (en) * | 1985-05-31 | 1990-02-28 | International Business Machines Corporation | Lithographic resists and method of using the same |
| JPS6484248A (en) * | 1987-09-28 | 1989-03-29 | Toshiba Corp | Resist pattern forming method |
-
1990
- 1990-11-20 FR FR9014462A patent/FR2669442B1/fr not_active Expired - Fee Related
-
1991
- 1991-11-14 KR KR1019930701503A patent/KR930703631A/ko not_active Withdrawn
- 1991-11-14 WO PCT/FR1991/000894 patent/WO1992009012A1/fr not_active Ceased
- 1991-11-14 JP JP4500419A patent/JPH06502502A/ja active Pending
- 1991-11-14 EP EP92902063A patent/EP0558666A1/fr not_active Withdrawn
- 1991-11-21 TW TW080109124A patent/TW202503B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2669442A1 (fr) | 1992-05-22 |
| EP0558666A1 (fr) | 1993-09-08 |
| TW202503B (cg-RX-API-DMAC10.html) | 1993-03-21 |
| WO1992009012A1 (fr) | 1992-05-29 |
| FR2669442B1 (fr) | 1996-06-28 |
| KR930703631A (ko) | 1993-11-30 |
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