TW202503B - - Google Patents
Download PDFInfo
- Publication number
- TW202503B TW202503B TW080109124A TW80109124A TW202503B TW 202503 B TW202503 B TW 202503B TW 080109124 A TW080109124 A TW 080109124A TW 80109124 A TW80109124 A TW 80109124A TW 202503 B TW202503 B TW 202503B
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- agent
- resin
- wash
- special
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 5
- 230000002262 irrigation Effects 0.000 claims description 5
- 238000003973 irrigation Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims 3
- 150000002632 lipids Chemical class 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 239000000758 substrate Substances 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- 238000005406 washing Methods 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000002309 gasification Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229940093476 ethylene glycol Drugs 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- WERLCVLDMOINSQ-UHFFFAOYSA-N 3-methylbutyl acetate 5-methylhexanoic acid Chemical compound CC(C)CCCC(O)=O.CC(C)CCOC(C)=O WERLCVLDMOINSQ-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000208140 Acer Species 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- 241000282346 Meles meles Species 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 208000036526 difference of sexual differentiation Diseases 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9014462A FR2669442B1 (fr) | 1990-11-20 | 1990-11-20 | Procede de transfert d'images topologiques. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202503B true TW202503B (cg-RX-API-DMAC10.html) | 1993-03-21 |
Family
ID=9402386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW080109124A TW202503B (cg-RX-API-DMAC10.html) | 1990-11-20 | 1991-11-21 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0558666A1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPH06502502A (cg-RX-API-DMAC10.html) |
| KR (1) | KR930703631A (cg-RX-API-DMAC10.html) |
| FR (1) | FR2669442B1 (cg-RX-API-DMAC10.html) |
| TW (1) | TW202503B (cg-RX-API-DMAC10.html) |
| WO (1) | WO1992009012A1 (cg-RX-API-DMAC10.html) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133738A (en) * | 1980-03-25 | 1981-10-20 | Mitsubishi Electric Corp | Forming method for pattern of photomask |
| US4308340A (en) * | 1980-08-08 | 1981-12-29 | American Hoechst Corporation | Aqueous 2-propoxyethanol containing processing composition for lithographic printing plates |
| JPS5872139A (ja) * | 1981-10-26 | 1983-04-30 | Tokyo Ohka Kogyo Co Ltd | 感光性材料 |
| JPS58187926A (ja) * | 1982-04-28 | 1983-11-02 | Toyo Soda Mfg Co Ltd | 放射線ネガ型レジストの現像方法 |
| US4600684A (en) * | 1983-02-10 | 1986-07-15 | Oki Electric Industry Co., Ltd. | Process for forming a negative resist using high energy beam |
| US4535054A (en) * | 1983-05-05 | 1985-08-13 | Hughes Aircraft Company | Wet process for developing styrene polymer resists for submicron lithography |
| EP0211161B1 (en) * | 1985-05-31 | 1990-02-28 | International Business Machines Corporation | Lithographic resists and method of using the same |
| JPS6484248A (en) * | 1987-09-28 | 1989-03-29 | Toshiba Corp | Resist pattern forming method |
-
1990
- 1990-11-20 FR FR9014462A patent/FR2669442B1/fr not_active Expired - Fee Related
-
1991
- 1991-11-14 KR KR1019930701503A patent/KR930703631A/ko not_active Withdrawn
- 1991-11-14 WO PCT/FR1991/000894 patent/WO1992009012A1/fr not_active Ceased
- 1991-11-14 JP JP4500419A patent/JPH06502502A/ja active Pending
- 1991-11-14 EP EP92902063A patent/EP0558666A1/fr not_active Withdrawn
- 1991-11-21 TW TW080109124A patent/TW202503B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06502502A (ja) | 1994-03-17 |
| FR2669442A1 (fr) | 1992-05-22 |
| EP0558666A1 (fr) | 1993-09-08 |
| WO1992009012A1 (fr) | 1992-05-29 |
| FR2669442B1 (fr) | 1996-06-28 |
| KR930703631A (ko) | 1993-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3987215A (en) | Resist mask formation process | |
| JPS5754317A (en) | Method and device for forming pattern | |
| JPS5817112A (ja) | ポジ型ノボラツクホトレジスト組成物及びその調製物 | |
| JPH0326826B2 (cg-RX-API-DMAC10.html) | ||
| US5443672A (en) | Process for coating circuit boards | |
| NZ208325A (en) | Radiation-sensitive compositions containing heat-sensitive dyes | |
| US3877939A (en) | Photopolymer printing plates and coated relief printing plates | |
| US3645732A (en) | Etching alcohol-soluble nylon with aqueous solutions | |
| TW202503B (cg-RX-API-DMAC10.html) | ||
| JPS61118744A (ja) | ポジ型ホトレジスト組成物 | |
| US6811931B1 (en) | Photomask original form having layer for protecting film surface and method for preparing the same, and protective layer-forming liquid for photomask original form | |
| US992898A (en) | Preparation of surfaces suitable for photo-engraving or photo-etching. | |
| US3619217A (en) | Desensitizer for photolithographic printing plate | |
| JPS60191238A (ja) | 画像複製材料およびその製造法 | |
| JPS6235350A (ja) | 像反転に有用な保存寿命の長いフオトレジスト | |
| JPS5934296B2 (ja) | 電子ビ−ムレジストおよびその使用方法 | |
| JPH0326825B2 (cg-RX-API-DMAC10.html) | ||
| US2927021A (en) | Method of producing a relief image | |
| US3288608A (en) | Light-sensitive coating for pre-sensitized plates intended for offset printing and for engraved wiring of printed circuits | |
| JPS61201237A (ja) | 感光性樹脂組成物 | |
| US3188211A (en) | Pretreatment of metallic base materials to be used in photoengraving processes | |
| JPS5466776A (en) | Fine pattern forming method | |
| US3366481A (en) | Photoengraving resists and compositions therefor | |
| CH284109A (de) | Verfahren zur Herstellung von mit Teilungen, Gittern, Strichzeichnungen, Flächenmarken usw. versehenen Gegenständen. | |
| JPS58111939A (ja) | 微細パタ−ン形成法 |