JPH0648835Y2 - 半導体製造装置用のカンチレバー - Google Patents
半導体製造装置用のカンチレバーInfo
- Publication number
- JPH0648835Y2 JPH0648835Y2 JP1988036027U JP3602788U JPH0648835Y2 JP H0648835 Y2 JPH0648835 Y2 JP H0648835Y2 JP 1988036027 U JP1988036027 U JP 1988036027U JP 3602788 U JP3602788 U JP 3602788U JP H0648835 Y2 JPH0648835 Y2 JP H0648835Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- opening
- boat
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 235000012431 wafers Nutrition 0.000 claims description 78
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036027U JPH0648835Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体製造装置用のカンチレバー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036027U JPH0648835Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体製造装置用のカンチレバー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139426U JPH01139426U (enrdf_load_stackoverflow) | 1989-09-22 |
| JPH0648835Y2 true JPH0648835Y2 (ja) | 1994-12-12 |
Family
ID=31262647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036027U Expired - Lifetime JPH0648835Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体製造装置用のカンチレバー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648835Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5326535B2 (ja) * | 2008-12-11 | 2013-10-30 | 信越化学工業株式会社 | 拡散炉装置及び拡散方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154017A (ja) * | 1983-02-22 | 1984-09-03 | Mitsubishi Electric Corp | 半導体ウエハの加熱炉用パドル |
-
1988
- 1988-03-18 JP JP1988036027U patent/JPH0648835Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01139426U (enrdf_load_stackoverflow) | 1989-09-22 |
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