JPH0648830Y2 - ウェーハ搬送機 - Google Patents
ウェーハ搬送機Info
- Publication number
- JPH0648830Y2 JPH0648830Y2 JP1987170188U JP17018887U JPH0648830Y2 JP H0648830 Y2 JPH0648830 Y2 JP H0648830Y2 JP 1987170188 U JP1987170188 U JP 1987170188U JP 17018887 U JP17018887 U JP 17018887U JP H0648830 Y2 JPH0648830 Y2 JP H0648830Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- temperature
- support
- unloading
- take
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 description 130
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987170188U JPH0648830Y2 (ja) | 1987-11-06 | 1987-11-06 | ウェーハ搬送機 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987170188U JPH0648830Y2 (ja) | 1987-11-06 | 1987-11-06 | ウェーハ搬送機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0173924U JPH0173924U (enrdf_load_stackoverflow) | 1989-05-18 |
JPH0648830Y2 true JPH0648830Y2 (ja) | 1994-12-12 |
Family
ID=31460914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987170188U Expired - Lifetime JPH0648830Y2 (ja) | 1987-11-06 | 1987-11-06 | ウェーハ搬送機 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648830Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57211729A (en) * | 1981-06-23 | 1982-12-25 | Fujitsu Ltd | Furnace for semiconductor heat treatment |
JPS619839U (ja) * | 1984-06-22 | 1986-01-21 | 真空理工株式会社 | 半導体アニ−ル装置におけるウエハ搬送装置 |
-
1987
- 1987-11-06 JP JP1987170188U patent/JPH0648830Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0173924U (enrdf_load_stackoverflow) | 1989-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2704309B2 (ja) | 基板処理装置及び基板の熱処理方法 | |
JPH07115058A (ja) | 基板冷却装置 | |
JPS6318326B2 (enrdf_load_stackoverflow) | ||
KR20190084875A (ko) | 열처리 장치, 열판의 냉각 방법 및 컴퓨터 판독 가능한 기록 매체 | |
JPH0648830Y2 (ja) | ウェーハ搬送機 | |
US7151239B2 (en) | Heat treating apparatus and heat treating method | |
JPH10189465A (ja) | 基板の熱処理装置およびそれを備える薄膜形成装置 | |
US5293404A (en) | Thermal measuring and testing system having synchronized sample transporting means | |
JPH04286143A (ja) | ウエハ処理装置 | |
JPH11168131A (ja) | ウエハ搬送チャック | |
CN111063623A (zh) | 基片处理装置、基片处理方法和存储介质 | |
JP3200952B2 (ja) | マルチリアクタタイプのプロセス設備制御装置 | |
JPH06252241A (ja) | 半導体製造装置 | |
JP2744985B2 (ja) | レジスト処理装置 | |
JP2006080410A (ja) | 半導体装置の製造方法 | |
JPH11204412A (ja) | 基板処理装置 | |
JPH0770495B2 (ja) | 熱処理装置 | |
JP2914592B2 (ja) | プラスチック成形方法及びその装置 | |
JP4401177B2 (ja) | 基板処理装置および基板処理方法 | |
JP2704597B2 (ja) | 半導体ウェーハの熱処理装置 | |
US20240426553A1 (en) | Industrial furnace system | |
JPH04225255A (ja) | Cvd装置におけるウェハ−の移載・装填制御方法及びその装置 | |
JPH0590385A (ja) | カセツトチヤンバ | |
JP4656348B2 (ja) | 温度制御方法及び温度制御装置 | |
JPH08236414A (ja) | 基板冷却装置 |