JPH0642368Y2 - 配線基板接合部の保護構造 - Google Patents
配線基板接合部の保護構造Info
- Publication number
- JPH0642368Y2 JPH0642368Y2 JP19864087U JP19864087U JPH0642368Y2 JP H0642368 Y2 JPH0642368 Y2 JP H0642368Y2 JP 19864087 U JP19864087 U JP 19864087U JP 19864087 U JP19864087 U JP 19864087U JP H0642368 Y2 JPH0642368 Y2 JP H0642368Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pattern
- soldering
- fpc
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 34
- 239000000758 substrate Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19864087U JPH0642368Y2 (ja) | 1987-12-26 | 1987-12-26 | 配線基板接合部の保護構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19864087U JPH0642368Y2 (ja) | 1987-12-26 | 1987-12-26 | 配線基板接合部の保護構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104062U JPH01104062U (enrdf_load_html_response) | 1989-07-13 |
| JPH0642368Y2 true JPH0642368Y2 (ja) | 1994-11-02 |
Family
ID=31489135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19864087U Expired - Lifetime JPH0642368Y2 (ja) | 1987-12-26 | 1987-12-26 | 配線基板接合部の保護構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642368Y2 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009200292A (ja) * | 2008-02-22 | 2009-09-03 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板および配線板の凸構造の形成方法 |
-
1987
- 1987-12-26 JP JP19864087U patent/JPH0642368Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01104062U (enrdf_load_html_response) | 1989-07-13 |
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