JPH0642342Y2 - 半導体装置封止用キヤツプ - Google Patents
半導体装置封止用キヤツプInfo
- Publication number
- JPH0642342Y2 JPH0642342Y2 JP65587U JP65587U JPH0642342Y2 JP H0642342 Y2 JPH0642342 Y2 JP H0642342Y2 JP 65587 U JP65587 U JP 65587U JP 65587 U JP65587 U JP 65587U JP H0642342 Y2 JPH0642342 Y2 JP H0642342Y2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- adhesive
- adhesive layer
- container
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP65587U JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP65587U JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63108638U JPS63108638U (de) | 1988-07-13 |
JPH0642342Y2 true JPH0642342Y2 (ja) | 1994-11-02 |
Family
ID=30777822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP65587U Expired - Lifetime JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0642342Y2 (de) |
-
1987
- 1987-01-06 JP JP65587U patent/JPH0642342Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63108638U (de) | 1988-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5455462A (en) | Plastic molded package with heat sink for integrated circuit devices | |
US6281566B1 (en) | Plastic package for electronic devices | |
JPS60195957A (ja) | リ−ドフレ−ム | |
JPH08288776A (ja) | プラスチック封止saw装置および方法 | |
JPH0642342Y2 (ja) | 半導体装置封止用キヤツプ | |
JPH043450A (ja) | 樹脂封止型半導体装置 | |
JP2564104Y2 (ja) | 半導体装置封止用キヤツプ | |
JP3141634B2 (ja) | 半導体装置の製造方法及び樹脂封止用金型 | |
JP2000150844A (ja) | 固体撮像装置の製造方法 | |
KR100237912B1 (ko) | 패키지 반도체, 그것을 이용한 반도체 장치 및 그 제조방법 | |
JPS5923525A (ja) | 半導体装置 | |
JPS6329960A (ja) | 樹脂封止型半導体装置用リ−ドフレ−ム | |
JPH03114247A (ja) | パッケージ型半導体装置 | |
JPS63184347A (ja) | 半導体パツケ−ジの開封方法 | |
CN115732340B (zh) | 封装方法及封装结构 | |
JPH04246847A (ja) | 半導体集積回路のパッケージ | |
JPH04129253A (ja) | 半導体パッケージ | |
JPS6232622A (ja) | 半導体装置用樹脂封止金型 | |
JPH01319970A (ja) | 半導体装置封止用容器 | |
JP2828283B2 (ja) | 半導体容器及びその製造方法 | |
JPH0794674A (ja) | 半導体装置およびその製造方法 | |
JPS6053060A (ja) | 半導体装置およびその製造方法 | |
JPS6059759A (ja) | リ−ドフレ−ム | |
JPH0126538B2 (de) | ||
JPH0738032A (ja) | パッケージ型半導体部品の構造 |