JPS63108638U - - Google Patents
Info
- Publication number
- JPS63108638U JPS63108638U JP65587U JP65587U JPS63108638U JP S63108638 U JPS63108638 U JP S63108638U JP 65587 U JP65587 U JP 65587U JP 65587 U JP65587 U JP 65587U JP S63108638 U JPS63108638 U JP S63108638U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- transverse groove
- thicker
- insulating member
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000003292 glue Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65587U JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65587U JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108638U true JPS63108638U (de) | 1988-07-13 |
| JPH0642342Y2 JPH0642342Y2 (ja) | 1994-11-02 |
Family
ID=30777822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP65587U Expired - Lifetime JPH0642342Y2 (ja) | 1987-01-06 | 1987-01-06 | 半導体装置封止用キヤツプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642342Y2 (de) |
-
1987
- 1987-01-06 JP JP65587U patent/JPH0642342Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642342Y2 (ja) | 1994-11-02 |