JPS63108638U - - Google Patents
Info
- Publication number
- JPS63108638U JPS63108638U JP65587U JP65587U JPS63108638U JP S63108638 U JPS63108638 U JP S63108638U JP 65587 U JP65587 U JP 65587U JP 65587 U JP65587 U JP 65587U JP S63108638 U JPS63108638 U JP S63108638U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- transverse groove
- thicker
- insulating member
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000003292 glue Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
第１図ａは、本考案の第一の実施例を示す平面
図、同図ｂは同図ａのＡ―Ａ線に沿つて切断し矢
印の方向から見たときの断面図、第２図は、本考
案の第２の実施例を示す平面図である。
１…絶縁部材、２，４…接着剤層、２ａ，４ａ
…溝両側の厚い接着剤層、３，５…接着剤層横断
溝。
Fig. 1a is a plan view showing the first embodiment of the present invention, Fig. 1b is a cross-sectional view taken along the line AA in Fig. FIG. 2 is a plan view showing a second embodiment of the present invention. 1... Insulating member, 2, 4... Adhesive layer, 2a, 4a
...thick adhesive layer on both sides of the groove, 3,5...glue layer crossing groove.
Claims (1)
の、一部分に横断溝を有する接着剤層が周辺に形
成された絶縁部材からなり、かつ、前記横断溝の
両側近傍の接着剤層は他の部分より部分的に厚く
されていることを特徴とする半導体装置封止用キ
ヤツプ。 An insulating member is formed around an adhesive layer having a transverse groove in a part thereof for adhering to a case containing a semiconductor chip, and the adhesive layer near both sides of the transverse groove is partially thicker than other parts. A cap for encapsulating a semiconductor device, which is characterized by being thicker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65587U JPH0642342Y2 (en) | 1987-01-06 | 1987-01-06 | Cap for semiconductor device encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65587U JPH0642342Y2 (en) | 1987-01-06 | 1987-01-06 | Cap for semiconductor device encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108638U true JPS63108638U (en) | 1988-07-13 |
| JPH0642342Y2 JPH0642342Y2 (en) | 1994-11-02 |
Family
ID=30777822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP65587U Expired - Lifetime JPH0642342Y2 (en) | 1987-01-06 | 1987-01-06 | Cap for semiconductor device encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642342Y2 (en) |
-
1987
- 1987-01-06 JP JP65587U patent/JPH0642342Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642342Y2 (en) | 1994-11-02 |