JPS63119258U - - Google Patents

Info

Publication number
JPS63119258U
JPS63119258U JP1104287U JP1104287U JPS63119258U JP S63119258 U JPS63119258 U JP S63119258U JP 1104287 U JP1104287 U JP 1104287U JP 1104287 U JP1104287 U JP 1104287U JP S63119258 U JPS63119258 U JP S63119258U
Authority
JP
Japan
Prior art keywords
chip
bonding pad
wire bonding
base
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1104287U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1104287U priority Critical patent/JPS63119258U/ja
Publication of JPS63119258U publication Critical patent/JPS63119258U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Fuses (AREA)
JP1104287U 1987-01-27 1987-01-27 Pending JPS63119258U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1104287U JPS63119258U (de) 1987-01-27 1987-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1104287U JPS63119258U (de) 1987-01-27 1987-01-27

Publications (1)

Publication Number Publication Date
JPS63119258U true JPS63119258U (de) 1988-08-02

Family

ID=30797901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1104287U Pending JPS63119258U (de) 1987-01-27 1987-01-27

Country Status (1)

Country Link
JP (1) JPS63119258U (de)

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