JPH0635469Y2 - 導電性接着剤乾燥装置 - Google Patents

導電性接着剤乾燥装置

Info

Publication number
JPH0635469Y2
JPH0635469Y2 JP1987019690U JP1969087U JPH0635469Y2 JP H0635469 Y2 JPH0635469 Y2 JP H0635469Y2 JP 1987019690 U JP1987019690 U JP 1987019690U JP 1969087 U JP1969087 U JP 1969087U JP H0635469 Y2 JPH0635469 Y2 JP H0635469Y2
Authority
JP
Japan
Prior art keywords
conductive adhesive
lead frame
stem
semiconductor element
harmful gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987019690U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63127130U (enrdf_load_stackoverflow
Inventor
佐登志 渡苅
英治 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1987019690U priority Critical patent/JPH0635469Y2/ja
Publication of JPS63127130U publication Critical patent/JPS63127130U/ja
Application granted granted Critical
Publication of JPH0635469Y2 publication Critical patent/JPH0635469Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987019690U 1987-02-12 1987-02-12 導電性接着剤乾燥装置 Expired - Lifetime JPH0635469Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Publications (2)

Publication Number Publication Date
JPS63127130U JPS63127130U (enrdf_load_stackoverflow) 1988-08-19
JPH0635469Y2 true JPH0635469Y2 (ja) 1994-09-14

Family

ID=30814515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987019690U Expired - Lifetime JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Country Status (1)

Country Link
JP (1) JPH0635469Y2 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS57109344A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Manufacture and its apparatus for semiconductor device
JPS57138335U (enrdf_load_stackoverflow) * 1981-02-23 1982-08-30

Also Published As

Publication number Publication date
JPS63127130U (enrdf_load_stackoverflow) 1988-08-19

Similar Documents

Publication Publication Date Title
JP2532915B2 (ja) ヒ―トシ―ル用ヒ―タ
JPH0342700B2 (enrdf_load_stackoverflow)
JPH0635469Y2 (ja) 導電性接着剤乾燥装置
JP2002538625A5 (enrdf_load_stackoverflow)
JPH1120358A (ja) Ｉｃカード用半導体装置の樹脂封止装置及び樹脂封止方法
JPS60234333A (ja) 加熱処理装置
JP3013656B2 (ja) 樹脂封止型半導体装置のパッケージ組立構造
JP2708121B2 (ja) ダイボンディング方法
JPS6155772B2 (enrdf_load_stackoverflow)
JPH0330297B2 (enrdf_load_stackoverflow)
JPH06334091A (ja) 半導体装置
JPH0955489A (ja) 固体撮像装置
JPH027453A (ja) ガラスキャップ法
JPS5992539A (ja) ワイヤボンデイング方法
JPS5656659A (en) Semiconductor device
JPS63197345A (ja) 半導体素子のダイスボンデイング方法
JP2703272B2 (ja) ワイヤボンディング装置
JPH10178120A (ja) 樹脂封止型半導体装置の除電方法
JPS6258536B2 (enrdf_load_stackoverflow)
JPS5817641A (ja) 封止用加熱機
JP2738069B2 (ja) ダイボンディング方法
JP2500768B2 (ja) 半導体装置の製造方法
JPH0661286A (ja) 部分的樹脂開封方法
JPH0354469B2 (enrdf_load_stackoverflow)
JPS55121655A (en) Manufacture of semiconductor device