JPS63127130U - - Google Patents
Info
- Publication number
- JPS63127130U JPS63127130U JP1969087U JP1969087U JPS63127130U JP S63127130 U JPS63127130 U JP S63127130U JP 1969087 U JP1969087 U JP 1969087U JP 1969087 U JP1969087 U JP 1969087U JP S63127130 U JPS63127130 U JP S63127130U
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- drying
- lead frame
- stem
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019690U JPH0635469Y2 (ja) | 1987-02-12 | 1987-02-12 | 導電性接着剤乾燥装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019690U JPH0635469Y2 (ja) | 1987-02-12 | 1987-02-12 | 導電性接着剤乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127130U true JPS63127130U (enrdf_load_stackoverflow) | 1988-08-19 |
| JPH0635469Y2 JPH0635469Y2 (ja) | 1994-09-14 |
Family
ID=30814515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987019690U Expired - Lifetime JPH0635469Y2 (ja) | 1987-02-12 | 1987-02-12 | 導電性接着剤乾燥装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635469Y2 (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113252A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Pellet bonding unit |
| JPS57109344A (en) * | 1980-12-26 | 1982-07-07 | Hitachi Ltd | Manufacture and its apparatus for semiconductor device |
| JPS57138335U (enrdf_load_stackoverflow) * | 1981-02-23 | 1982-08-30 |
-
1987
- 1987-02-12 JP JP1987019690U patent/JPH0635469Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113252A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Pellet bonding unit |
| JPS57109344A (en) * | 1980-12-26 | 1982-07-07 | Hitachi Ltd | Manufacture and its apparatus for semiconductor device |
| JPS57138335U (enrdf_load_stackoverflow) * | 1981-02-23 | 1982-08-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635469Y2 (ja) | 1994-09-14 |