JPS54113252A - Pellet bonding unit - Google Patents

Pellet bonding unit

Info

Publication number
JPS54113252A
JPS54113252A JP1980678A JP1980678A JPS54113252A JP S54113252 A JPS54113252 A JP S54113252A JP 1980678 A JP1980678 A JP 1980678A JP 1980678 A JP1980678 A JP 1980678A JP S54113252 A JPS54113252 A JP S54113252A
Authority
JP
Japan
Prior art keywords
block
tab
main groove
lead frame
stopping plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980678A
Other languages
Japanese (ja)
Inventor
Osamu Yamaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1980678A priority Critical patent/JPS54113252A/en
Publication of JPS54113252A publication Critical patent/JPS54113252A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve the operation ratio of a unit by providing a main groove and auxiliary grooves orthogonal to the main groove on the upper face of a heat block and providing a protrusion in positions corresponding to auxiliary grooves on a stopping plate and making the block into a non-contact state at a lead frame movement time.
CONSTITUTION: Main groove 23 which is wider than the tab width going along the movement direction of a lead frame is provided at the center of a block on the upper face of heat block 22, and auxiliary grooves 24 which are orthogonal to main groove 23 are provided at a prescrived interval correspondingly to the pitch between adjacent tab leads of the lead frame. Meanwhile, a stopping plate arranged above heat block 22 is prepared with low tab stopping plate 26 and flat stopping plate 31 and is provided with a pair of trapezoidal stopping pieces 27 on the lower face and presses relatively a part of the lead, which extends near the tab lead or the tab, against block 22. Further, when the lead frame is moving on the guide, block 22 is made into a non-contact state at least. As a result, bonding can be exact, and the operation ratio can be improved.
COPYRIGHT: (C)1979,JPO&Japio
JP1980678A 1978-02-24 1978-02-24 Pellet bonding unit Pending JPS54113252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980678A JPS54113252A (en) 1978-02-24 1978-02-24 Pellet bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980678A JPS54113252A (en) 1978-02-24 1978-02-24 Pellet bonding unit

Publications (1)

Publication Number Publication Date
JPS54113252A true JPS54113252A (en) 1979-09-04

Family

ID=12009568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980678A Pending JPS54113252A (en) 1978-02-24 1978-02-24 Pellet bonding unit

Country Status (1)

Country Link
JP (1) JPS54113252A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923734U (en) * 1982-07-31 1984-02-14 株式会社新川 heating device
JPS6112037A (en) * 1984-06-27 1986-01-20 Oki Electric Ind Co Ltd Die-bonding method
JPS6196554U (en) * 1984-11-29 1986-06-21
JPS63127130U (en) * 1987-02-12 1988-08-19
JP2015026781A (en) * 2013-07-29 2015-02-05 トヨタ自動車株式会社 Lead frame, power conversion device, semiconductor device, and method of manufacturing semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923734U (en) * 1982-07-31 1984-02-14 株式会社新川 heating device
JPH0319223Y2 (en) * 1982-07-31 1991-04-23
JPS6112037A (en) * 1984-06-27 1986-01-20 Oki Electric Ind Co Ltd Die-bonding method
JPH0478012B2 (en) * 1984-06-27 1992-12-10 Oki Denki Kogyo Kk
JPS6196554U (en) * 1984-11-29 1986-06-21
JPS63127130U (en) * 1987-02-12 1988-08-19
JP2015026781A (en) * 2013-07-29 2015-02-05 トヨタ自動車株式会社 Lead frame, power conversion device, semiconductor device, and method of manufacturing semiconductor device

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