JPS54113252A - Pellet bonding unit - Google Patents
Pellet bonding unitInfo
- Publication number
- JPS54113252A JPS54113252A JP1980678A JP1980678A JPS54113252A JP S54113252 A JPS54113252 A JP S54113252A JP 1980678 A JP1980678 A JP 1980678A JP 1980678 A JP1980678 A JP 1980678A JP S54113252 A JPS54113252 A JP S54113252A
- Authority
- JP
- Japan
- Prior art keywords
- block
- tab
- main groove
- lead frame
- stopping plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To improve the operation ratio of a unit by providing a main groove and auxiliary grooves orthogonal to the main groove on the upper face of a heat block and providing a protrusion in positions corresponding to auxiliary grooves on a stopping plate and making the block into a non-contact state at a lead frame movement time.
CONSTITUTION: Main groove 23 which is wider than the tab width going along the movement direction of a lead frame is provided at the center of a block on the upper face of heat block 22, and auxiliary grooves 24 which are orthogonal to main groove 23 are provided at a prescrived interval correspondingly to the pitch between adjacent tab leads of the lead frame. Meanwhile, a stopping plate arranged above heat block 22 is prepared with low tab stopping plate 26 and flat stopping plate 31 and is provided with a pair of trapezoidal stopping pieces 27 on the lower face and presses relatively a part of the lead, which extends near the tab lead or the tab, against block 22. Further, when the lead frame is moving on the guide, block 22 is made into a non-contact state at least. As a result, bonding can be exact, and the operation ratio can be improved.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980678A JPS54113252A (en) | 1978-02-24 | 1978-02-24 | Pellet bonding unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980678A JPS54113252A (en) | 1978-02-24 | 1978-02-24 | Pellet bonding unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54113252A true JPS54113252A (en) | 1979-09-04 |
Family
ID=12009568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980678A Pending JPS54113252A (en) | 1978-02-24 | 1978-02-24 | Pellet bonding unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113252A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5923734U (en) * | 1982-07-31 | 1984-02-14 | 株式会社新川 | heating device |
JPS6112037A (en) * | 1984-06-27 | 1986-01-20 | Oki Electric Ind Co Ltd | Die-bonding method |
JPS6196554U (en) * | 1984-11-29 | 1986-06-21 | ||
JPS63127130U (en) * | 1987-02-12 | 1988-08-19 | ||
JP2015026781A (en) * | 2013-07-29 | 2015-02-05 | トヨタ自動車株式会社 | Lead frame, power conversion device, semiconductor device, and method of manufacturing semiconductor device |
-
1978
- 1978-02-24 JP JP1980678A patent/JPS54113252A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5923734U (en) * | 1982-07-31 | 1984-02-14 | 株式会社新川 | heating device |
JPH0319223Y2 (en) * | 1982-07-31 | 1991-04-23 | ||
JPS6112037A (en) * | 1984-06-27 | 1986-01-20 | Oki Electric Ind Co Ltd | Die-bonding method |
JPH0478012B2 (en) * | 1984-06-27 | 1992-12-10 | Oki Denki Kogyo Kk | |
JPS6196554U (en) * | 1984-11-29 | 1986-06-21 | ||
JPS63127130U (en) * | 1987-02-12 | 1988-08-19 | ||
JP2015026781A (en) * | 2013-07-29 | 2015-02-05 | トヨタ自動車株式会社 | Lead frame, power conversion device, semiconductor device, and method of manufacturing semiconductor device |
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