JPH06338671A - プリント基板の製造方法 - Google Patents

プリント基板の製造方法

Info

Publication number
JPH06338671A
JPH06338671A JP14973293A JP14973293A JPH06338671A JP H06338671 A JPH06338671 A JP H06338671A JP 14973293 A JP14973293 A JP 14973293A JP 14973293 A JP14973293 A JP 14973293A JP H06338671 A JPH06338671 A JP H06338671A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
cut
outer shape
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14973293A
Other languages
English (en)
Japanese (ja)
Inventor
Tatsuya Horiuchi
達也 堀内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Priority to JP14973293A priority Critical patent/JPH06338671A/ja
Priority to GB9410718A priority patent/GB2278733A/en
Priority to MYPI9401363 priority patent/MY131675A/en
Priority to TW83105563A priority patent/TW246762B/zh
Publication of JPH06338671A publication Critical patent/JPH06338671A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP14973293A 1993-05-31 1993-05-31 プリント基板の製造方法 Pending JPH06338671A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP14973293A JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法
GB9410718A GB2278733A (en) 1993-05-31 1994-05-27 Production of printed wiring boards
MYPI9401363 MY131675A (en) 1993-05-31 1994-05-30 Process for producing printed wiring board
TW83105563A TW246762B (cs) 1993-05-31 1994-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14973293A JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法

Publications (1)

Publication Number Publication Date
JPH06338671A true JPH06338671A (ja) 1994-12-06

Family

ID=15481608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14973293A Pending JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法

Country Status (4)

Country Link
JP (1) JPH06338671A (cs)
GB (1) GB2278733A (cs)
MY (1) MY131675A (cs)
TW (1) TW246762B (cs)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074594A (ja) * 1983-09-30 1985-04-26 日立電子株式会社 ハイブリッドｉｃ用小片基板の製造方法
JPS61187292A (ja) * 1985-02-14 1986-08-20 三菱電機株式会社 電子部品の製造方法
JPS62257787A (ja) * 1986-04-30 1987-11-10 富士通株式会社 モジユ−ルプリント板の多数個取り方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1009027A (en) * 1974-09-23 1977-04-26 Matthew J. Walsh Method of producing printed circuit boards in multiple units

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074594A (ja) * 1983-09-30 1985-04-26 日立電子株式会社 ハイブリッドｉｃ用小片基板の製造方法
JPS61187292A (ja) * 1985-02-14 1986-08-20 三菱電機株式会社 電子部品の製造方法
JPS62257787A (ja) * 1986-04-30 1987-11-10 富士通株式会社 モジユ−ルプリント板の多数個取り方法

Also Published As

Publication number Publication date
MY131675A (en) 2007-08-30
GB9410718D0 (en) 1994-07-13
GB2278733A (en) 1994-12-07
TW246762B (cs) 1995-05-01

Similar Documents

Publication Publication Date Title
JPH1022630A (ja) 金属ベースプリント基板の分割方法
JPH06338671A (ja) プリント基板の製造方法
JPS6370489A (ja) 金属ベ−スプリント配線板の加工方法
JPH0770808B2 (ja) 端面スルーホール基板の切断方法
JPS624879B2 (cs)
JP3245231B2 (ja) フラットケーブル回路の製造方法
JP2000225597A (ja) プリント配線基板用切断工具
JP2005223266A (ja) 基板の端面スルーホール製造方法
JP2943305B2 (ja) プリント配線板の製造方法
JPH0927659A (ja) フレキシブルプリント基板原板
JPH0745975Y2 (ja) 多面取り基板
JPH09232717A (ja) クラック低減方法
US6585024B1 (en) Positioning target for laminated printed circuit board
JPS609079A (ja) リ−ド端子の製造方法
JPH02230787A (ja) プリント配線基板
JPH0569968U (ja) 多面付プリント板
JP2877019B2 (ja) プリント配線板の金型構造
JPH08102568A (ja) シート状フレキシブルプリント配線板
JPH02121728A (ja) プリント基板のミシン目加工方法
JP2000084627A (ja) 板状部品の加工方法
JPH06333443A (ja) スリット加工方法及び金型
JPH0639470Y2 (ja) プリント配線用基板
JPH0936505A (ja) フレキシブルプリント基板原板
KR20010028869A (ko) 인쇄회로기판의 윈도우 형성방법
JPH10296351A (ja) 板状部品の加工方法