TW246762B - - Google Patents
Info
- Publication number
- TW246762B TW246762B TW83105563A TW83105563A TW246762B TW 246762 B TW246762 B TW 246762B TW 83105563 A TW83105563 A TW 83105563A TW 83105563 A TW83105563 A TW 83105563A TW 246762 B TW246762 B TW 246762B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14973293A JPH06338671A (ja) | 1993-05-31 | 1993-05-31 | プリント基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW246762B true TW246762B (cs) | 1995-05-01 |
Family
ID=15481608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83105563A TW246762B (cs) | 1993-05-31 | 1994-06-20 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH06338671A (cs) |
| GB (1) | GB2278733A (cs) |
| MY (1) | MY131675A (cs) |
| TW (1) | TW246762B (cs) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1009027A (en) * | 1974-09-23 | 1977-04-26 | Matthew J. Walsh | Method of producing printed circuit boards in multiple units |
| JPS6074594A (ja) * | 1983-09-30 | 1985-04-26 | 日立電子株式会社 | ハイブリッドｉｃ用小片基板の製造方法 |
| JPS61187292A (ja) * | 1985-02-14 | 1986-08-20 | 三菱電機株式会社 | 電子部品の製造方法 |
| JPS62257787A (ja) * | 1986-04-30 | 1987-11-10 | 富士通株式会社 | モジユ−ルプリント板の多数個取り方法 |
-
1993
- 1993-05-31 JP JP14973293A patent/JPH06338671A/ja active Pending
-
1994
- 1994-05-27 GB GB9410718A patent/GB2278733A/en not_active Withdrawn
- 1994-05-30 MY MYPI9401363 patent/MY131675A/en unknown
- 1994-06-20 TW TW83105563A patent/TW246762B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| MY131675A (en) | 2007-08-30 |
| JPH06338671A (ja) | 1994-12-06 |
| GB9410718D0 (en) | 1994-07-13 |
| GB2278733A (en) | 1994-12-07 |