MY131675A - Process for producing printed wiring board - Google Patents

Process for producing printed wiring board

Info

Publication number
MY131675A
MY131675A MYPI9401363A MY131675A MY 131675 A MY131675 A MY 131675A MY PI9401363 A MYPI9401363 A MY PI9401363A MY 131675 A MY131675 A MY 131675A
Authority
MY
Malaysia
Prior art keywords
printed wiring
wiring boards
portions
similar
another
Prior art date
Application number
Other languages
English (en)
Inventor
Tatsuya Horiuchi
Original Assignee
Sankyo Seiki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Seisakusho Kk filed Critical Sankyo Seiki Seisakusho Kk
Publication of MY131675A publication Critical patent/MY131675A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
MYPI9401363 1993-05-31 1994-05-30 Process for producing printed wiring board MY131675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14973293A JPH06338671A (ja) 1993-05-31 1993-05-31 プリント基板の製造方法

Publications (1)

Publication Number Publication Date
MY131675A true MY131675A (en) 2007-08-30

Family

ID=15481608

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9401363 MY131675A (en) 1993-05-31 1994-05-30 Process for producing printed wiring board

Country Status (4)

Country Link
JP (1) JPH06338671A (cs)
GB (1) GB2278733A (cs)
MY (1) MY131675A (cs)
TW (1) TW246762B (cs)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1009027A (en) * 1974-09-23 1977-04-26 Matthew J. Walsh Method of producing printed circuit boards in multiple units
JPS6074594A (ja) * 1983-09-30 1985-04-26 日立電子株式会社 ハイブリッドｉｃ用小片基板の製造方法
JPS61187292A (ja) * 1985-02-14 1986-08-20 三菱電機株式会社 電子部品の製造方法
JPS62257787A (ja) * 1986-04-30 1987-11-10 富士通株式会社 モジユ−ルプリント板の多数個取り方法

Also Published As

Publication number Publication date
JPH06338671A (ja) 1994-12-06
GB9410718D0 (en) 1994-07-13
GB2278733A (en) 1994-12-07
TW246762B (cs) 1995-05-01

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