JPH0625976Y2 - 電子回路用基板接続体 - Google Patents

電子回路用基板接続体

Info

Publication number
JPH0625976Y2
JPH0625976Y2 JP1987060142U JP6014287U JPH0625976Y2 JP H0625976 Y2 JPH0625976 Y2 JP H0625976Y2 JP 1987060142 U JP1987060142 U JP 1987060142U JP 6014287 U JP6014287 U JP 6014287U JP H0625976 Y2 JPH0625976 Y2 JP H0625976Y2
Authority
JP
Japan
Prior art keywords
electronic circuit
substrate
electronic
component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987060142U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63167774U (US20080094685A1-20080424-C00004.png
Inventor
潔 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Terumo Corp
Original Assignee
Terumo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Terumo Corp filed Critical Terumo Corp
Priority to JP1987060142U priority Critical patent/JPH0625976Y2/ja
Priority to US07/184,364 priority patent/US4851964A/en
Publication of JPS63167774U publication Critical patent/JPS63167774U/ja
Application granted granted Critical
Publication of JPH0625976Y2 publication Critical patent/JPH0625976Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Combinations Of Printed Boards (AREA)
JP1987060142U 1987-04-21 1987-04-21 電子回路用基板接続体 Expired - Lifetime JPH0625976Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987060142U JPH0625976Y2 (ja) 1987-04-21 1987-04-21 電子回路用基板接続体
US07/184,364 US4851964A (en) 1987-04-21 1988-04-21 Connecting mechanism for electronic circuit board blanks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987060142U JPH0625976Y2 (ja) 1987-04-21 1987-04-21 電子回路用基板接続体

Publications (2)

Publication Number Publication Date
JPS63167774U JPS63167774U (US20080094685A1-20080424-C00004.png) 1988-11-01
JPH0625976Y2 true JPH0625976Y2 (ja) 1994-07-06

Family

ID=13133595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987060142U Expired - Lifetime JPH0625976Y2 (ja) 1987-04-21 1987-04-21 電子回路用基板接続体

Country Status (2)

Country Link
US (1) US4851964A (US20080094685A1-20080424-C00004.png)
JP (1) JPH0625976Y2 (US20080094685A1-20080424-C00004.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035867A1 (ja) * 2010-09-17 2012-03-22 オムロンヘルスケア株式会社 電子体温計およびその製造方法
WO2012035866A1 (ja) * 2010-09-17 2012-03-22 オムロンヘルスケア株式会社 電子体温計およびその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648749B2 (ja) * 1989-06-02 1994-06-22 ローム株式会社 電子部品製造用基板
US5503895A (en) * 1993-09-20 1996-04-02 Bi-Link Metal Specialties Supply feedstock for workpiece finishing machine
US5511661A (en) * 1993-11-01 1996-04-30 Clix Products, Inc. Plastic paper clip and integral sheet-like packaging thereof
US5711421A (en) * 1996-09-12 1998-01-27 Guo; Wen Li Spray gun assembly
EP0886608B1 (en) * 1996-10-22 2004-04-07 THOMAS & BETTS CORPORATION Cable tie bandoliers for use with automatic tools
US5967316A (en) * 1997-10-22 1999-10-19 Thomas & Betts International, Inc. Cable tie bandoliers for use with automatic tools
JP3558921B2 (ja) * 1999-05-14 2004-08-25 シャープ株式会社 テープキャリア並びにテープキャリア型半導体装置の製造方法
US8887913B2 (en) * 2005-12-19 2014-11-18 Symmetry Medical Manufacturing, Inc. Grommet matrix
CN110027800A (zh) * 2018-01-12 2019-07-19 许修义 一种连体的扎带

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3550766A (en) * 1969-03-03 1970-12-29 David Nixen Flat electronic package assembly
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
JPS552568Y2 (US20080094685A1-20080424-C00004.png) * 1974-12-25 1980-01-23
JPS5254874U (US20080094685A1-20080424-C00004.png) * 1975-10-20 1977-04-20
JPS54182848U (US20080094685A1-20080424-C00004.png) * 1978-06-16 1979-12-25
JPS5634363U (US20080094685A1-20080424-C00004.png) * 1979-08-22 1981-04-03
JPS58124973U (ja) * 1982-02-17 1983-08-25 アルプス電気株式会社 回路基板
US4565458A (en) * 1982-03-01 1986-01-21 The Torrington Company Roller bearing
JPS58165390A (ja) * 1982-03-26 1983-09-30 株式会社日立製作所 分割プリント基板
JPS5916173U (ja) * 1982-07-22 1984-01-31 富士通株式会社 多数個取りプリント板
JPS5993167U (ja) * 1982-12-15 1984-06-25 三菱電機株式会社 連取式プリント基板
JPS6036923A (ja) * 1983-08-09 1985-02-26 Terumo Corp 電子体温計
JPS60157031A (ja) * 1984-01-27 1985-08-17 Terumo Corp 電子体温計
US4600971A (en) * 1984-05-11 1986-07-15 Amp Incorporated Lead frames with dielectric housings molded thereon
US4611262A (en) * 1984-05-11 1986-09-09 Amp Incorporated Electrical circuit package for greeting cards

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035867A1 (ja) * 2010-09-17 2012-03-22 オムロンヘルスケア株式会社 電子体温計およびその製造方法
WO2012035866A1 (ja) * 2010-09-17 2012-03-22 オムロンヘルスケア株式会社 電子体温計およびその製造方法
CN103140744A (zh) * 2010-09-17 2013-06-05 欧姆龙健康医疗事业株式会社 电子体温计及其制造方法
US9316544B2 (en) 2010-09-17 2016-04-19 Omron Healthcare Co., Ltd. Electronic thermometer and method for manufacturing the same

Also Published As

Publication number Publication date
US4851964A (en) 1989-07-25
JPS63167774U (US20080094685A1-20080424-C00004.png) 1988-11-01

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