JPH0622991Y2 - 化合物半導体ウエハ - Google Patents

化合物半導体ウエハ

Info

Publication number
JPH0622991Y2
JPH0622991Y2 JP1990019977U JP1997790U JPH0622991Y2 JP H0622991 Y2 JPH0622991 Y2 JP H0622991Y2 JP 1990019977 U JP1990019977 U JP 1990019977U JP 1997790 U JP1997790 U JP 1997790U JP H0622991 Y2 JPH0622991 Y2 JP H0622991Y2
Authority
JP
Japan
Prior art keywords
scribe line
substrate
compound semiconductor
film
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990019977U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02116739U (enrdf_load_stackoverflow
Inventor
博 長山
昌章 伊東
誠一 高橋
勝三 上西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1990019977U priority Critical patent/JPH0622991Y2/ja
Publication of JPH02116739U publication Critical patent/JPH02116739U/ja
Application granted granted Critical
Publication of JPH0622991Y2 publication Critical patent/JPH0622991Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP1990019977U 1990-02-28 1990-02-28 化合物半導体ウエハ Expired - Lifetime JPH0622991Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019977U JPH0622991Y2 (ja) 1990-02-28 1990-02-28 化合物半導体ウエハ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019977U JPH0622991Y2 (ja) 1990-02-28 1990-02-28 化合物半導体ウエハ

Publications (2)

Publication Number Publication Date
JPH02116739U JPH02116739U (enrdf_load_stackoverflow) 1990-09-19
JPH0622991Y2 true JPH0622991Y2 (ja) 1994-06-15

Family

ID=31235964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019977U Expired - Lifetime JPH0622991Y2 (ja) 1990-02-28 1990-02-28 化合物半導体ウエハ

Country Status (1)

Country Link
JP (1) JPH0622991Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7557430B2 (en) * 2006-05-25 2009-07-07 Skyworks Solutions, Inc. Semiconductor seal ring

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919012A (enrdf_load_stackoverflow) * 1972-06-12 1974-02-20
JPS5331279B2 (enrdf_load_stackoverflow) * 1972-07-28 1978-09-01
JPS55124243A (en) * 1979-03-20 1980-09-25 Nec Corp Compound semiconductor device
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device
JPS5893266A (ja) * 1981-11-30 1983-06-02 Toshiba Corp 半導体集積回路

Also Published As

Publication number Publication date
JPH02116739U (enrdf_load_stackoverflow) 1990-09-19

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