JPH0622991Y2 - 化合物半導体ウエハ - Google Patents
化合物半導体ウエハInfo
- Publication number
- JPH0622991Y2 JPH0622991Y2 JP1990019977U JP1997790U JPH0622991Y2 JP H0622991 Y2 JPH0622991 Y2 JP H0622991Y2 JP 1990019977 U JP1990019977 U JP 1990019977U JP 1997790 U JP1997790 U JP 1997790U JP H0622991 Y2 JPH0622991 Y2 JP H0622991Y2
- Authority
- JP
- Japan
- Prior art keywords
- scribe line
- substrate
- compound semiconductor
- film
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019977U JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019977U JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02116739U JPH02116739U (enrdf_load_stackoverflow) | 1990-09-19 |
| JPH0622991Y2 true JPH0622991Y2 (ja) | 1994-06-15 |
Family
ID=31235964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990019977U Expired - Lifetime JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622991Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7557430B2 (en) * | 2006-05-25 | 2009-07-07 | Skyworks Solutions, Inc. | Semiconductor seal ring |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919012A (enrdf_load_stackoverflow) * | 1972-06-12 | 1974-02-20 | ||
| JPS5331279B2 (enrdf_load_stackoverflow) * | 1972-07-28 | 1978-09-01 | ||
| JPS55124243A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Compound semiconductor device |
| JPS57164546A (en) * | 1981-04-03 | 1982-10-09 | Oki Electric Ind Co Ltd | Semiconductor device |
| JPS5893266A (ja) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | 半導体集積回路 |
-
1990
- 1990-02-28 JP JP1990019977U patent/JPH0622991Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02116739U (enrdf_load_stackoverflow) | 1990-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5552345A (en) | Die separation method for silicon on diamond circuit structures | |
| JPH04276645A (ja) | 化合物半導体ウエーハのダイシング方法 | |
| JP2861991B2 (ja) | 窒化ガリウム系化合物半導体チップの製造方法 | |
| US7655539B2 (en) | Dice by grind for back surface metallized dies | |
| JPH0622991Y2 (ja) | 化合物半導体ウエハ | |
| JPH0774131A (ja) | ダイシング装置及び半導体チップの加工方法 | |
| JPH08330576A (ja) | Ｎ−型ｈｉｇｆｅｔおよび方法 | |
| US12283614B2 (en) | Semiconductor device | |
| JPS61251147A (ja) | 半導体ウエハのチツプ分割方法 | |
| JPS61251052A (ja) | 半導体ウエハのチツプ分割方法 | |
| JPH06151583A (ja) | 化合物半導体ウエハ | |
| JPS61251050A (ja) | 半導体ウエハのチツプ分割方法 | |
| JP2004221423A (ja) | 半導体装置の製造方法 | |
| JPS61251148A (ja) | 半導体ウエハのチツプ分割方法 | |
| JPH11265898A (ja) | 半導体装置及びその製造方法 | |
| JPH05285935A (ja) | 半導体基板の分割方法 | |
| JPS61251051A (ja) | 半導体ウエハのチツプ分割方法 | |
| JPH08195483A (ja) | Ｓｏｉ基板及びその製造方法 | |
| US20200219769A1 (en) | Plasma die singulation systems and related methods | |
| JPH06338563A (ja) | 半導体装置及びその製造方法 | |
| TW480742B (en) | Method for cutting III-group nitride semiconductor light-emitting element | |
| JPS60149151A (ja) | 半導体ウエハのダイシング方法 | |
| JP3500169B2 (ja) | 半導体装置の製造方法 | |
| JPH05326697A (ja) | 半導体装置の製造方法 | |
| JP2000150423A (ja) | 化合物半導体装置の製造方法 |