JPH0622978Y2 - 銀ろう付きリードピン - Google Patents
銀ろう付きリードピンInfo
- Publication number
- JPH0622978Y2 JPH0622978Y2 JP1989013283U JP1328389U JPH0622978Y2 JP H0622978 Y2 JPH0622978 Y2 JP H0622978Y2 JP 1989013283 U JP1989013283 U JP 1989013283U JP 1328389 U JP1328389 U JP 1328389U JP H0622978 Y2 JPH0622978 Y2 JP H0622978Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- silver brazing
- wire
- attached
- brazing wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title 1
- 238000005219 brazing Methods 0.000 claims description 59
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 58
- 229910052709 silver Inorganic materials 0.000 claims description 58
- 239000004332 silver Substances 0.000 claims description 58
- 238000003466 welding Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989013283U JPH0622978Y2 (ja) | 1989-02-06 | 1989-02-06 | 銀ろう付きリードピン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989013283U JPH0622978Y2 (ja) | 1989-02-06 | 1989-02-06 | 銀ろう付きリードピン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104622U JPH02104622U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-20 |
| JPH0622978Y2 true JPH0622978Y2 (ja) | 1994-06-15 |
Family
ID=31223457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989013283U Expired - Lifetime JPH0622978Y2 (ja) | 1989-02-06 | 1989-02-06 | 銀ろう付きリードピン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622978Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344218U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-09-04 | 1988-03-24 |
-
1989
- 1989-02-06 JP JP1989013283U patent/JPH0622978Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104622U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |