JPH0617299Y2 - 半導体製造装置用ステージへの被処理材固定装置 - Google Patents
半導体製造装置用ステージへの被処理材固定装置Info
- Publication number
- JPH0617299Y2 JPH0617299Y2 JP1987155789U JP15578987U JPH0617299Y2 JP H0617299 Y2 JPH0617299 Y2 JP H0617299Y2 JP 1987155789 U JP1987155789 U JP 1987155789U JP 15578987 U JP15578987 U JP 15578987U JP H0617299 Y2 JPH0617299 Y2 JP H0617299Y2
- Authority
- JP
- Japan
- Prior art keywords
- processed
- stage
- edge portion
- size
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000013077 target material Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987155789U JPH0617299Y2 (ja) | 1987-10-12 | 1987-10-12 | 半導体製造装置用ステージへの被処理材固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987155789U JPH0617299Y2 (ja) | 1987-10-12 | 1987-10-12 | 半導体製造装置用ステージへの被処理材固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0160538U JPH0160538U (enrdf_load_stackoverflow) | 1989-04-17 |
JPH0617299Y2 true JPH0617299Y2 (ja) | 1994-05-02 |
Family
ID=31433727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987155789U Expired - Lifetime JPH0617299Y2 (ja) | 1987-10-12 | 1987-10-12 | 半導体製造装置用ステージへの被処理材固定装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617299Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3323291C2 (de) * | 1983-06-28 | 1985-04-25 | Windmöller & Hölscher, 4540 Lengerich | Vorrichtung zum Überführen von flachen Werkstücken in eine Werkstückschuppe |
JPS6010983U (ja) * | 1983-07-02 | 1985-01-25 | 住友電気工業株式会社 | 補強入りポリエチレンパイプ |
-
1987
- 1987-10-12 JP JP1987155789U patent/JPH0617299Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0160538U (enrdf_load_stackoverflow) | 1989-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH05102056A (ja) | ウエハー支持具 | |
JPH0298923A (ja) | 薄い基板用の支持装置 | |
KR19990077855A (ko) | 다이싱을 위한 네스트와 이에 사용되는 테이프리스 기판을 컷팅하기 위한 방법 및 장치 | |
US4711438A (en) | Mask holding | |
JPH0617299Y2 (ja) | 半導体製造装置用ステージへの被処理材固定装置 | |
JPH0831514B2 (ja) | 基板の吸着装置 | |
JP3349572B2 (ja) | 薄板固定装置 | |
JPH0648853Y2 (ja) | 半導体製造装置用ステージへの被処理材固定装置 | |
JP3368139B2 (ja) | 電子ビーム描画装置用試料ステージ | |
JP3340151B2 (ja) | ウエハー載置装置 | |
JP2000306982A (ja) | ウェハサイズコンバーションホルダー及びそれを用いたウェハの保持方法 | |
JP3708984B2 (ja) | 被処理材の固定装置 | |
JPH07302831A (ja) | 共用試料ホールダ | |
JPH0215934A (ja) | 保持装置 | |
CN100413048C (zh) | 盒基座及晶片检查装置 | |
JP2573759B2 (ja) | 基板の位置決め装置 | |
JP2526199Y2 (ja) | ウェハホルダの固定構造 | |
JPH09205131A (ja) | 半導体製造装置用ステージへの被処理材固定装置 | |
JP2005091051A (ja) | 薄板の水平保持装置 | |
KR100238947B1 (ko) | 반도체 웨이퍼 탑재장치 | |
JPH068100Y2 (ja) | ウエハ移し替え突き上げ装置 | |
JPH02312259A (ja) | 半導体ウエハ検査治具 | |
JPS6322673Y2 (enrdf_load_stackoverflow) | ||
JPH05259265A (ja) | 試料ホルダ | |
JPH10218339A (ja) | 搬送装置 |