JPH0610717Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0610717Y2 JPH0610717Y2 JP1986022430U JP2243086U JPH0610717Y2 JP H0610717 Y2 JPH0610717 Y2 JP H0610717Y2 JP 1986022430 U JP1986022430 U JP 1986022430U JP 2243086 U JP2243086 U JP 2243086U JP H0610717 Y2 JPH0610717 Y2 JP H0610717Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductive path
- integrated circuit
- hybrid integrated
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986022430U JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986022430U JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62135464U JPS62135464U (hu) | 1987-08-26 |
JPH0610717Y2 true JPH0610717Y2 (ja) | 1994-03-16 |
Family
ID=30819804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986022430U Expired - Lifetime JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0610717Y2 (hu) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815374U (ja) * | 1981-07-21 | 1983-01-31 | 電気化学工業株式会社 | 回路プリント基板 |
-
1986
- 1986-02-19 JP JP1986022430U patent/JPH0610717Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62135464U (hu) | 1987-08-26 |
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