JPH0587197B2 - - Google Patents
Info
- Publication number
- JPH0587197B2 JPH0587197B2 JP28197388A JP28197388A JPH0587197B2 JP H0587197 B2 JPH0587197 B2 JP H0587197B2 JP 28197388 A JP28197388 A JP 28197388A JP 28197388 A JP28197388 A JP 28197388A JP H0587197 B2 JPH0587197 B2 JP H0587197B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- etching
- conveyor
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 description 37
- 239000007921 spray Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000005507 spraying Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Belt Conveyors (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28197388A JPH02128493A (ja) | 1988-11-08 | 1988-11-08 | プリント配線基板の搬送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28197388A JPH02128493A (ja) | 1988-11-08 | 1988-11-08 | プリント配線基板の搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02128493A JPH02128493A (ja) | 1990-05-16 |
| JPH0587197B2 true JPH0587197B2 (ko) | 1993-12-15 |
Family
ID=17646478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28197388A Granted JPH02128493A (ja) | 1988-11-08 | 1988-11-08 | プリント配線基板の搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02128493A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231155A (ja) * | 1994-02-16 | 1995-08-29 | Fujitsu Ltd | プリント配線板のエッチング装置及びエッチング方法 |
| WO2005012144A1 (ja) * | 2003-07-30 | 2005-02-10 | Nec Machinery Corporation | ワーク搬送装置およびそれを用いたダイボンダ |
| KR101540073B1 (ko) * | 2015-04-10 | 2015-07-30 | 고봉재 | 분사형 기판 솔더링 장치 |
| CN105620063B (zh) * | 2016-01-30 | 2017-11-24 | 南京轩世琪源软件科技有限公司 | 集成电路板打码自动加工设备 |
-
1988
- 1988-11-08 JP JP28197388A patent/JPH02128493A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02128493A (ja) | 1990-05-16 |
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