JPH0579500B2 - - Google Patents

Info

Publication number
JPH0579500B2
JPH0579500B2 JP60069634A JP6963485A JPH0579500B2 JP H0579500 B2 JPH0579500 B2 JP H0579500B2 JP 60069634 A JP60069634 A JP 60069634A JP 6963485 A JP6963485 A JP 6963485A JP H0579500 B2 JPH0579500 B2 JP H0579500B2
Authority
JP
Japan
Prior art keywords
metal foil
epoxy resin
resin
laminate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60069634A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61227041A (ja
Inventor
Yasuo Fushiki
Minoru Itsushiki
Koji Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP6963485A priority Critical patent/JPS61227041A/ja
Publication of JPS61227041A publication Critical patent/JPS61227041A/ja
Publication of JPH0579500B2 publication Critical patent/JPH0579500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
JP6963485A 1985-04-01 1985-04-01 金属箔張り積層板およびその製造法 Granted JPS61227041A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6963485A JPS61227041A (ja) 1985-04-01 1985-04-01 金属箔張り積層板およびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6963485A JPS61227041A (ja) 1985-04-01 1985-04-01 金属箔張り積層板およびその製造法

Publications (2)

Publication Number Publication Date
JPS61227041A JPS61227041A (ja) 1986-10-09
JPH0579500B2 true JPH0579500B2 (enrdf_load_stackoverflow) 1993-11-02

Family

ID=13408486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6963485A Granted JPS61227041A (ja) 1985-04-01 1985-04-01 金属箔張り積層板およびその製造法

Country Status (1)

Country Link
JP (1) JPS61227041A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125284A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Production of flexible printed circuit
JPS5912920A (ja) * 1982-07-14 1984-01-23 Mitsui Toatsu Chem Inc 熱硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS61227041A (ja) 1986-10-09

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