JPH0577356B2 - - Google Patents

Info

Publication number
JPH0577356B2
JPH0577356B2 JP62319879A JP31987987A JPH0577356B2 JP H0577356 B2 JPH0577356 B2 JP H0577356B2 JP 62319879 A JP62319879 A JP 62319879A JP 31987987 A JP31987987 A JP 31987987A JP H0577356 B2 JPH0577356 B2 JP H0577356B2
Authority
JP
Japan
Prior art keywords
thin film
substrate
film
tip
tacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62319879A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01160085A (ja
Inventor
Mitsuhiro Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP62319879A priority Critical patent/JPH01160085A/ja
Priority to US07/285,553 priority patent/US4983248A/en
Priority to EP88121101A priority patent/EP0320964A3/en
Priority to CA000586163A priority patent/CA1294858C/en
Publication of JPH01160085A publication Critical patent/JPH01160085A/ja
Publication of JPH0577356B2 publication Critical patent/JPH0577356B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1741—Progressive continuous bonding press [e.g., roll couples]

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
JP62319879A 1987-12-16 1987-12-16 薄膜の張付方法及びその実施装置 Granted JPH01160085A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62319879A JPH01160085A (ja) 1987-12-16 1987-12-16 薄膜の張付方法及びその実施装置
US07/285,553 US4983248A (en) 1987-12-16 1988-12-16 Thin-film coating method and apparatus therefor
EP88121101A EP0320964A3 (en) 1987-12-16 1988-12-16 Thin-film coating apparatus
CA000586163A CA1294858C (en) 1987-12-16 1988-12-16 Thin-film coating method and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62319879A JPH01160085A (ja) 1987-12-16 1987-12-16 薄膜の張付方法及びその実施装置

Publications (2)

Publication Number Publication Date
JPH01160085A JPH01160085A (ja) 1989-06-22
JPH0577356B2 true JPH0577356B2 (cg-RX-API-DMAC7.html) 1993-10-26

Family

ID=18115256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62319879A Granted JPH01160085A (ja) 1987-12-16 1987-12-16 薄膜の張付方法及びその実施装置

Country Status (4)

Country Link
US (1) US4983248A (cg-RX-API-DMAC7.html)
EP (1) EP0320964A3 (cg-RX-API-DMAC7.html)
JP (1) JPH01160085A (cg-RX-API-DMAC7.html)
CA (1) CA1294858C (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0651360B2 (ja) * 1989-06-04 1994-07-06 ソマール株式会社 薄膜の張付方法及びその装置
JPH03147833A (ja) * 1989-11-04 1991-06-24 Somar Corp 薄膜張付方法及びその実施装置
JPH0412849A (ja) * 1990-04-28 1992-01-17 Somar Corp ラミネータ
US5389185A (en) * 1992-04-03 1995-02-14 Somar Corporation Film sticking apparatus
US5372670A (en) * 1994-02-02 1994-12-13 International Business Machines Corporation System for wet application of a dry film to a panel
JP2006264020A (ja) * 2005-03-23 2006-10-05 Fuji Photo Film Co Ltd 積層基板の製造方法及び装置
USD601597S1 (en) * 2008-09-03 2009-10-06 P & B Construction, Inc. Enclosed chamber, adjustable finish-applicator for flat and dimensional surfaces
CN101835344B (zh) * 2010-04-30 2012-06-13 高德（无锡）电子有限公司 滴水装置
US8932939B1 (en) * 2014-04-14 2015-01-13 Applied Materials, Inc. Water soluble mask formation by dry film lamination
CN111424256A (zh) * 2020-04-30 2020-07-17 江苏菲沃泰纳米科技有限公司 镀膜方法及其防护层

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3991708A (en) * 1975-06-23 1976-11-16 Moore Business Forms, Inc. Gravure-type adhesive applicator
FR2333583A1 (fr) * 1975-12-01 1977-07-01 Nal Pour Expl Oceans Centre Dispositif pour appliquer un revetement sur une surface immergee
US4378264A (en) * 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
US4338152A (en) * 1981-02-17 1982-07-06 E. I. Du Pont De Nemours And Company Gripping arrangement for an apparatus for automatically laminating circuit boards
US4605454A (en) * 1982-09-01 1986-08-12 Kimberly-Clark Corporation Method of ultrasonically bonding nonwoven webs
US4495014A (en) * 1983-02-18 1985-01-22 E. I. Du Pont De Nemours And Company Laminating and trimming process
JPS6071229A (ja) * 1983-09-29 1985-04-23 Somar Corp オ−トラミネ−タ
FR2568495B1 (fr) * 1984-08-02 1986-10-24 Cegedur Dispositif de brossage et le lubrification en continu de cylindres de laminoirs pour produits plats lamines.
DE3787197T2 (de) * 1986-05-07 1993-12-16 Somar Corp Gerät zur Herstellung von Schichtpressstoffen.

Also Published As

Publication number Publication date
JPH01160085A (ja) 1989-06-22
EP0320964A3 (en) 1990-06-27
CA1294858C (en) 1992-01-28
EP0320964A2 (en) 1989-06-21
US4983248A (en) 1991-01-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees