JPH0576179B2 - - Google Patents

Info

Publication number
JPH0576179B2
JPH0576179B2 JP29215287A JP29215287A JPH0576179B2 JP H0576179 B2 JPH0576179 B2 JP H0576179B2 JP 29215287 A JP29215287 A JP 29215287A JP 29215287 A JP29215287 A JP 29215287A JP H0576179 B2 JPH0576179 B2 JP H0576179B2
Authority
JP
Japan
Prior art keywords
lead frame
station
mold
preheating
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29215287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01135029A (ja
Inventor
Takahiro Tsuzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP29215287A priority Critical patent/JPH01135029A/ja
Publication of JPH01135029A publication Critical patent/JPH01135029A/ja
Publication of JPH0576179B2 publication Critical patent/JPH0576179B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP29215287A 1987-11-20 1987-11-20 リードフレーム供給装置 Granted JPH01135029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29215287A JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29215287A JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Publications (2)

Publication Number Publication Date
JPH01135029A JPH01135029A (ja) 1989-05-26
JPH0576179B2 true JPH0576179B2 (enExample) 1993-10-22

Family

ID=17778213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29215287A Granted JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Country Status (1)

Country Link
JP (1) JPH01135029A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03143838A (ja) * 1989-10-25 1991-06-19 Fujitsu Miyagi Electron:Kk 半導体製造装置
CN119028876A (zh) * 2024-08-19 2024-11-26 江西万年芯微电子有限公司 用于引线框架的同步预热设备及预热控制方法

Also Published As

Publication number Publication date
JPH01135029A (ja) 1989-05-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees