JPH01135029A - リードフレーム供給装置 - Google Patents

リードフレーム供給装置

Info

Publication number
JPH01135029A
JPH01135029A JP29215287A JP29215287A JPH01135029A JP H01135029 A JPH01135029 A JP H01135029A JP 29215287 A JP29215287 A JP 29215287A JP 29215287 A JP29215287 A JP 29215287A JP H01135029 A JPH01135029 A JP H01135029A
Authority
JP
Japan
Prior art keywords
lead frame
station
mold
preheating
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29215287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576179B2 (enExample
Inventor
Takahiro Tsuzuki
都築　隆博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP29215287A priority Critical patent/JPH01135029A/ja
Publication of JPH01135029A publication Critical patent/JPH01135029A/ja
Publication of JPH0576179B2 publication Critical patent/JPH0576179B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP29215287A 1987-11-20 1987-11-20 リードフレーム供給装置 Granted JPH01135029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29215287A JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29215287A JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Publications (2)

Publication Number Publication Date
JPH01135029A true JPH01135029A (ja) 1989-05-26
JPH0576179B2 JPH0576179B2 (enExample) 1993-10-22

Family

ID=17778213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29215287A Granted JPH01135029A (ja) 1987-11-20 1987-11-20 リードフレーム供給装置

Country Status (1)

Country Link
JP (1) JPH01135029A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03143838A (ja) * 1989-10-25 1991-06-19 Fujitsu Miyagi Electron:Kk 半導体製造装置
CN119028876A (zh) * 2024-08-19 2024-11-26 江西万年芯微电子有限公司 用于引线框架的同步预热设备及预热控制方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03143838A (ja) * 1989-10-25 1991-06-19 Fujitsu Miyagi Electron:Kk 半導体製造装置
CN119028876A (zh) * 2024-08-19 2024-11-26 江西万年芯微电子有限公司 用于引线框架的同步预热设备及预热控制方法

Also Published As

Publication number Publication date
JPH0576179B2 (enExample) 1993-10-22

Similar Documents

Publication Publication Date Title
WO1993020996A1 (en) Method of transfer mold and apparatus for transfer mold
JPH01135029A (ja) リードフレーム供給装置
JP5329809B2 (ja) ワークピースの搬送及び位置変更装置
JP2003524896A (ja) 電子部品を処理するための装置および方法
JPS6151407A (ja) コンベア装置
JPS59172731A (ja) リ−ドフレ−ム搬送装置
JP3911402B2 (ja) 半導体封止装置
JP3714765B2 (ja) プレス装置の搬送機構
JPS60145000A (ja) 導体板用加工装置の導体板受渡し装置
JP2001028378A (ja) 半導体装置封止装置
JP2590097B2 (ja) 金型を用いる成形設備
WO2007001179A2 (en) Method and device for supplying and discharging carriers with electronic components
CN110814443B (zh) 一种爆震传感器螺母自动攻丝机
JPH0332410B2 (enExample)
WO2025215967A1 (ja) 樹脂封止装置
JPS63178595A (ja) プリント基板供給装置
JP2514013Y2 (ja) 印刷配線板用供給機
JP3699801B2 (ja) 半導体製造部品供給機構
TW202505649A (zh) 搬送裝置、樹脂成形裝置及樹脂成形品的製造方法
WO2025234249A1 (ja) ワーク供給装置、樹脂封止装置及びワーク供給方法
JPS6246532Y2 (enExample)
JP2817080B2 (ja) ボンディング装置
JPS60183733A (ja) ダイボンデイング装置
JP2007238237A (ja) ワーク搬送装置
JP2000208532A (ja) ワ―ク搬送装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees