JPH0575196B2 - - Google Patents
Info
- Publication number
- JPH0575196B2 JPH0575196B2 JP24518885A JP24518885A JPH0575196B2 JP H0575196 B2 JPH0575196 B2 JP H0575196B2 JP 24518885 A JP24518885 A JP 24518885A JP 24518885 A JP24518885 A JP 24518885A JP H0575196 B2 JPH0575196 B2 JP H0575196B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- printed wiring
- wiring board
- soldering
- pattern portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 description 16
- 239000006071 cream Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24518885A JPS62104192A (ja) | 1985-10-31 | 1985-10-31 | レ−ザ半田付け用プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24518885A JPS62104192A (ja) | 1985-10-31 | 1985-10-31 | レ−ザ半田付け用プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104192A JPS62104192A (ja) | 1987-05-14 |
| JPH0575196B2 true JPH0575196B2 (enrdf_load_stackoverflow) | 1993-10-20 |
Family
ID=17129923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24518885A Granted JPS62104192A (ja) | 1985-10-31 | 1985-10-31 | レ−ザ半田付け用プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104192A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03205895A (ja) * | 1990-01-08 | 1991-09-09 | Nec Corp | 電子部品実装方法 |
-
1985
- 1985-10-31 JP JP24518885A patent/JPS62104192A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62104192A (ja) | 1987-05-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |