JPH0573123B2 - - Google Patents

Info

Publication number
JPH0573123B2
JPH0573123B2 JP7368587A JP7368587A JPH0573123B2 JP H0573123 B2 JPH0573123 B2 JP H0573123B2 JP 7368587 A JP7368587 A JP 7368587A JP 7368587 A JP7368587 A JP 7368587A JP H0573123 B2 JPH0573123 B2 JP H0573123B2
Authority
JP
Japan
Prior art keywords
epoxy resin
weight
composition according
parts
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7368587A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63238125A (ja
Inventor
Toshio Shiobara
Koji Futatsumori
Shinichi Jingu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP7368587A priority Critical patent/JPS63238125A/ja
Publication of JPS63238125A publication Critical patent/JPS63238125A/ja
Publication of JPH0573123B2 publication Critical patent/JPH0573123B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7368587A 1987-03-26 1987-03-26 エポキシ樹脂組成物 Granted JPS63238125A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7368587A JPS63238125A (ja) 1987-03-26 1987-03-26 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7368587A JPS63238125A (ja) 1987-03-26 1987-03-26 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS63238125A JPS63238125A (ja) 1988-10-04
JPH0573123B2 true JPH0573123B2 (ko) 1993-10-13

Family

ID=13525314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7368587A Granted JPS63238125A (ja) 1987-03-26 1987-03-26 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS63238125A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185320A (ja) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH02127417A (ja) * 1988-11-08 1990-05-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH02173034A (ja) * 1988-12-26 1990-07-04 Sumitomo Bakelite Co Ltd エポキシ樹脂
JPH02281023A (ja) * 1989-04-21 1990-11-16 Sumitomo Bakelite Co Ltd 硬化性エポキシ樹脂組成物
JP2555801B2 (ja) * 1991-05-28 1996-11-20 信越化学工業株式会社 液晶シール材用エポキシ樹脂組成物及び液晶シール材

Also Published As

Publication number Publication date
JPS63238125A (ja) 1988-10-04

Similar Documents

Publication Publication Date Title
US5248710A (en) Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
JPS6355532B2 (ko)
JP2002020586A (ja) エポキシ樹脂組成物
JPH0627180B2 (ja) エポキシ樹脂組成物及び半導体装置
US5190995A (en) Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
JPS6360069B2 (ko)
JPS62212417A (ja) エポキシ樹脂組成物
JPH0573123B2 (ko)
JPH06157551A (ja) シリコーン変性酸無水物及びその製造方法
JPH02305848A (ja) 液状エポキシ樹脂組成物及びその硬化物
JPH062797B2 (ja) エポキシ樹脂組成物
JPH0573124B2 (ko)
JPS6248968B2 (ko)
JP2705493B2 (ja) 液状エポキシ樹脂組成物及び半導体装置
JP2555801B2 (ja) 液晶シール材用エポキシ樹脂組成物及び液晶シール材
JPS63226951A (ja) 樹脂封止型半導体装置
JPH0660232B2 (ja) 液状エポキシ樹脂組成物
JPH06256364A (ja) 有機ケイ素化合物、その製法及びそれを含有する樹脂組成物
JPH0346486B2 (ko)
JP2643714B2 (ja) 液状エポキシ樹脂組成物及び硬化物
JPS63199220A (ja) エポキシ樹脂組成物
JP2546121B2 (ja) 有機珪素化合物及びこの化合物を含むエポキシ樹脂組成物
JPH0573768B2 (ko)
JP3497293B2 (ja) 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2591365B2 (ja) 液状エポキシ樹脂組成物及び半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 14

Free format text: PAYMENT UNTIL: 20071013