JPH0571189B2 - - Google Patents
Info
- Publication number
- JPH0571189B2 JPH0571189B2 JP62089711A JP8971187A JPH0571189B2 JP H0571189 B2 JPH0571189 B2 JP H0571189B2 JP 62089711 A JP62089711 A JP 62089711A JP 8971187 A JP8971187 A JP 8971187A JP H0571189 B2 JPH0571189 B2 JP H0571189B2
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- electrode layer
- layer
- polycrystalline silicon
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
- H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
- H10D64/664—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures the additional layers comprising a barrier layer between the layer of silicon and an upper metal or metal silicide layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
- H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089711A JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089711A JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63255964A JPS63255964A (ja) | 1988-10-24 |
| JPH0571189B2 true JPH0571189B2 (enExample) | 1993-10-06 |
Family
ID=13978354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62089711A Granted JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63255964A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU638812B2 (en) * | 1990-04-16 | 1993-07-08 | Digital Equipment Corporation | A method of operating a semiconductor device |
| JP2558931B2 (ja) * | 1990-07-13 | 1996-11-27 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP3548984B2 (ja) * | 1991-11-14 | 2004-08-04 | 富士通株式会社 | 半導体装置の製造方法 |
| JPH11307765A (ja) | 1998-04-20 | 1999-11-05 | Nec Corp | 半導体装置及びその製造方法 |
-
1987
- 1987-04-14 JP JP62089711A patent/JPS63255964A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63255964A (ja) | 1988-10-24 |
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