JPS63255964A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS63255964A JPS63255964A JP62089711A JP8971187A JPS63255964A JP S63255964 A JPS63255964 A JP S63255964A JP 62089711 A JP62089711 A JP 62089711A JP 8971187 A JP8971187 A JP 8971187A JP S63255964 A JPS63255964 A JP S63255964A
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- polycrystalline silicon
- electrode layer
- layer
- threshold value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
- H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
- H10D64/664—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures the additional layers comprising a barrier layer between the layer of silicon and an upper metal or metal silicide layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
- H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089711A JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089711A JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63255964A true JPS63255964A (ja) | 1988-10-24 |
| JPH0571189B2 JPH0571189B2 (enExample) | 1993-10-06 |
Family
ID=13978354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62089711A Granted JPS63255964A (ja) | 1987-04-14 | 1987-04-14 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63255964A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472763A (ja) * | 1990-07-13 | 1992-03-06 | Toshiba Corp | 半導体装置およびその製造方法 |
| JPH0818045A (ja) * | 1990-04-16 | 1996-01-19 | Digital Equip Corp <Dec> | 時間依存性絶縁破損を減少させた半導体デバイス |
| US5497018A (en) * | 1991-11-14 | 1996-03-05 | Fujitsu Limited | Semiconductor memory device having a floating gate with improved insulation film quality |
| US6297529B1 (en) | 1998-04-20 | 2001-10-02 | Nec Corporation | Semiconductor device with multilayered gate structure |
-
1987
- 1987-04-14 JP JP62089711A patent/JPS63255964A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818045A (ja) * | 1990-04-16 | 1996-01-19 | Digital Equip Corp <Dec> | 時間依存性絶縁破損を減少させた半導体デバイス |
| JPH0472763A (ja) * | 1990-07-13 | 1992-03-06 | Toshiba Corp | 半導体装置およびその製造方法 |
| US5256894A (en) * | 1990-07-13 | 1993-10-26 | Kabushiki Kaisha Toshiba | Semiconductor device having variable impurity concentration polysilicon layer |
| US5497018A (en) * | 1991-11-14 | 1996-03-05 | Fujitsu Limited | Semiconductor memory device having a floating gate with improved insulation film quality |
| US6297529B1 (en) | 1998-04-20 | 2001-10-02 | Nec Corporation | Semiconductor device with multilayered gate structure |
| KR100326953B1 (ko) * | 1998-04-20 | 2002-03-13 | 가네꼬 히사시 | 반도체장치 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0571189B2 (enExample) | 1993-10-06 |
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