JPH0570934B2 - - Google Patents

Info

Publication number
JPH0570934B2
JPH0570934B2 JP59232905A JP23290584A JPH0570934B2 JP H0570934 B2 JPH0570934 B2 JP H0570934B2 JP 59232905 A JP59232905 A JP 59232905A JP 23290584 A JP23290584 A JP 23290584A JP H0570934 B2 JPH0570934 B2 JP H0570934B2
Authority
JP
Japan
Prior art keywords
detection area
pattern recognition
positional deviation
bonding
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59232905A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61111549A (ja
Inventor
Mitsuki Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59232905A priority Critical patent/JPS61111549A/ja
Publication of JPS61111549A publication Critical patent/JPS61111549A/ja
Publication of JPH0570934B2 publication Critical patent/JPH0570934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59232905A 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置 Granted JPS61111549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59232905A JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59232905A JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61111549A JPS61111549A (ja) 1986-05-29
JPH0570934B2 true JPH0570934B2 (enrdf_load_stackoverflow) 1993-10-06

Family

ID=16946672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59232905A Granted JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61111549A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5903229B2 (ja) * 2011-08-30 2016-04-13 ファスフォードテクノロジ株式会社 ダイボンダ及び半導体製造方法

Also Published As

Publication number Publication date
JPS61111549A (ja) 1986-05-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term