JPH0236066B2 - - Google Patents

Info

Publication number
JPH0236066B2
JPH0236066B2 JP59225564A JP22556484A JPH0236066B2 JP H0236066 B2 JPH0236066 B2 JP H0236066B2 JP 59225564 A JP59225564 A JP 59225564A JP 22556484 A JP22556484 A JP 22556484A JP H0236066 B2 JPH0236066 B2 JP H0236066B2
Authority
JP
Japan
Prior art keywords
coordinate
alignment
bonding
pattern
new
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59225564A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61102747A (ja
Inventor
Jusuke Hirata
Yoshikatsu Hayashizaki
Kazunori Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59225564A priority Critical patent/JPS61102747A/ja
Publication of JPS61102747A publication Critical patent/JPS61102747A/ja
Publication of JPH0236066B2 publication Critical patent/JPH0236066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59225564A 1984-10-26 1984-10-26 ワイヤ−ボンダ−の認識パタ−ン変更方法 Granted JPS61102747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59225564A JPS61102747A (ja) 1984-10-26 1984-10-26 ワイヤ−ボンダ−の認識パタ−ン変更方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59225564A JPS61102747A (ja) 1984-10-26 1984-10-26 ワイヤ−ボンダ−の認識パタ−ン変更方法

Publications (2)

Publication Number Publication Date
JPS61102747A JPS61102747A (ja) 1986-05-21
JPH0236066B2 true JPH0236066B2 (enrdf_load_stackoverflow) 1990-08-15

Family

ID=16831275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59225564A Granted JPS61102747A (ja) 1984-10-26 1984-10-26 ワイヤ−ボンダ−の認識パタ−ン変更方法

Country Status (1)

Country Link
JP (1) JPS61102747A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362242A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンディング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50100983A (enrdf_load_stackoverflow) * 1973-10-29 1975-08-11
JPS549580A (en) * 1977-06-24 1979-01-24 Kaijo Denki Kk Method of matching semiconductor wire bonds
JPS5681950A (en) * 1979-12-07 1981-07-04 Toshiba Corp Position detecting method
JPS5733852A (en) * 1980-08-08 1982-02-24 Meidensha Electric Mfg Co Ltd Data exchanging method for loop transmission
JPS5749242A (en) * 1980-09-09 1982-03-23 Toshiba Corp Wire bonding device

Also Published As

Publication number Publication date
JPS61102747A (ja) 1986-05-21

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Legal Events

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