JPS5681950A - Position detecting method - Google Patents

Position detecting method

Info

Publication number
JPS5681950A
JPS5681950A JP15896979A JP15896979A JPS5681950A JP S5681950 A JPS5681950 A JP S5681950A JP 15896979 A JP15896979 A JP 15896979A JP 15896979 A JP15896979 A JP 15896979A JP S5681950 A JPS5681950 A JP S5681950A
Authority
JP
Japan
Prior art keywords
pad
pads
detected
displacement
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15896979A
Other languages
Japanese (ja)
Inventor
Yoshinori Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15896979A priority Critical patent/JPS5681950A/en
Publication of JPS5681950A publication Critical patent/JPS5681950A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE:To simplify and accurately detect the displacement of the pad position to be used for a specific detection by a method wherein a mutual distance is calculated from the pad position on the chip detected at a visual field region and it is compared with the distance in the normal position. CONSTITUTION:The distance of each pad in a region A against pads 2b1 and 2b2 in the normal position is calculated from a coordinate information and it is memorized. Then the position of each pad 2 within regions A and B is detected by an image detection, for instance, pads 2a1, 2a3 and 2a4 are computed as against pads 2b2 and 2b3, their distances are calculated and are compared with the normal distance information. As a result, the detected pad image can be corresponded to the reference pad and the amount of displacement of the chip 1 can be found by specifying the pads 2b2 and 2a3 as the pads to be used for detection. In this constitution, the amount of displacement is detected without shifting the visual field and a high- speed and highly precise detection of positional displacement can be performed without using a complicated mechanism.
JP15896979A 1979-12-07 1979-12-07 Position detecting method Pending JPS5681950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15896979A JPS5681950A (en) 1979-12-07 1979-12-07 Position detecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15896979A JPS5681950A (en) 1979-12-07 1979-12-07 Position detecting method

Publications (1)

Publication Number Publication Date
JPS5681950A true JPS5681950A (en) 1981-07-04

Family

ID=15683321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15896979A Pending JPS5681950A (en) 1979-12-07 1979-12-07 Position detecting method

Country Status (1)

Country Link
JP (1) JPS5681950A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100534A (en) * 1982-11-30 1984-06-09 Canon Inc Location detecting process
JPS59100533A (en) * 1982-11-30 1984-06-09 Canon Inc Location detector
JPS61102747A (en) * 1984-10-26 1986-05-21 Marine Instr Co Ltd Method of varying recognition pattern for wire bonder
JPH0385738A (en) * 1989-08-30 1991-04-10 Mitsubishi Electric Corp Identification device of semiconductor device and its identification method
JPH07161759A (en) * 1993-12-06 1995-06-23 Nec Corp Wire bonding device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100534A (en) * 1982-11-30 1984-06-09 Canon Inc Location detecting process
JPS59100533A (en) * 1982-11-30 1984-06-09 Canon Inc Location detector
JPS61102747A (en) * 1984-10-26 1986-05-21 Marine Instr Co Ltd Method of varying recognition pattern for wire bonder
JPH0236066B2 (en) * 1984-10-26 1990-08-15 Kaijo Denki Kk
JPH0385738A (en) * 1989-08-30 1991-04-10 Mitsubishi Electric Corp Identification device of semiconductor device and its identification method
JPH07161759A (en) * 1993-12-06 1995-06-23 Nec Corp Wire bonding device

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