JPH0565313B2 - - Google Patents
Info
- Publication number
- JPH0565313B2 JPH0565313B2 JP10272288A JP10272288A JPH0565313B2 JP H0565313 B2 JPH0565313 B2 JP H0565313B2 JP 10272288 A JP10272288 A JP 10272288A JP 10272288 A JP10272288 A JP 10272288A JP H0565313 B2 JPH0565313 B2 JP H0565313B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- grinding wheel
- round hole
- manufacturing
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 239000006061 abrasive grain Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (ja) | 1988-04-27 | 1988-04-27 | ダイヤフラムの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (ja) | 1988-04-27 | 1988-04-27 | ダイヤフラムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63295167A JPS63295167A (ja) | 1988-12-01 |
| JPH0565313B2 true JPH0565313B2 (enExample) | 1993-09-17 |
Family
ID=14335160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10272288A Granted JPS63295167A (ja) | 1988-04-27 | 1988-04-27 | ダイヤフラムの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63295167A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5390740B2 (ja) * | 2005-04-27 | 2014-01-15 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2008130808A (ja) * | 2006-11-21 | 2008-06-05 | Disco Abrasive Syst Ltd | 研削加工方法 |
-
1988
- 1988-04-27 JP JP10272288A patent/JPS63295167A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63295167A (ja) | 1988-12-01 |
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