JPH0565313B2 - - Google Patents
Info
- Publication number
- JPH0565313B2 JPH0565313B2 JP10272288A JP10272288A JPH0565313B2 JP H0565313 B2 JPH0565313 B2 JP H0565313B2 JP 10272288 A JP10272288 A JP 10272288A JP 10272288 A JP10272288 A JP 10272288A JP H0565313 B2 JPH0565313 B2 JP H0565313B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- grinding wheel
- round hole
- manufacturing
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 239000006061 abrasive grain Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Pressure Sensors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、半導体圧力センサのダイヤフラムの
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method for manufacturing a diaphragm for a semiconductor pressure sensor.
（従来の技術）
近時、シリコン（Si）単結晶基板に薄肉のダイ
ヤフラムを形成し、このダイヤフラム上に逆導電
性の不純物を短冊状に拡散してピエゾ抵抗ゲージ
を形成した半導体圧力センサが産業界の各分野に
普及している。一般に、この半導体圧力センサの
ダイヤフラムの加工は、化学的エツチング法によ
り行われている。しかし、この方法によれば、加
工能率がすこぶる低いうえに、加工の再現性に乏
しく所要の加工精度を得ることが困難であつた。
そこで、例えば本出願人による出願である特願昭
57−87306号「ダイヤフラム製造方法」に開示さ
れているように、ダイヤフラムの加工を従来の化
学的エツチング法に代えて、研削砥石により行う
試みがなされている。この場合、使用される研削
砥石としては、通常、第１図に示すようなストレ
ートカツプ形のダイヤモンド砥石(G)が用いられて
いる。ところが、このようなストレートカツプ形
の研削砥石を連続して用いると先端外縁部(C)が破
線で示すように次第に減耗し、所要の加工精度
（例えばダイヤフラムのコーナ部の丸みの半径が
0.25mm以下）を達成することができなくなり、先
端が減耗していない研削砥石と頻繁に交換せねば
ならない不具合があつた。(Prior technology) Recently, semiconductor pressure sensors have been developed industrially, in which a thin diaphragm is formed on a silicon (Si) single crystal substrate, and a piezoresistance gauge is formed by diffusing impurities of opposite conductivity onto the diaphragm in the form of strips. It is widespread in various fields of the world. Generally, the diaphragm of this semiconductor pressure sensor is processed by a chemical etching method. However, according to this method, the machining efficiency is extremely low, and the reproducibility of machining is poor, making it difficult to obtain the required machining accuracy.
Therefore, for example, in the patent application filed by the present applicant,
As disclosed in No. 57-87306 entitled "Diaphragm Manufacturing Method," attempts have been made to process the diaphragm using a grinding wheel instead of the conventional chemical etching method. In this case, the grinding wheel used is usually a straight cup-shaped diamond grinding wheel (G) as shown in FIG. However, if such a straight cup-shaped grinding wheel is used continuously, the outer edge of the tip (C) will gradually wear out as shown by the broken line, and the required machining accuracy (for example, the radius of the rounded corner of the diaphragm) will deteriorate.
0.25mm or less), and the tip of the grinding wheel had to be replaced frequently with one that was not worn out.
（発明が解決しようとする課題）
本発明は、上記事情を勘案してなされたもの
で、研削砥石の先端部が減耗しても新しいものと
交換する必要のないダイヤフラムの製造方法を提
供することを目的とする。(Problems to be Solved by the Invention) The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a method for manufacturing a diaphragm that does not require replacing the tip of a grinding wheel with a new one even if it wears out. With the goal.
（課題を解決するための手段と作用）
丸穴加工を行うストレートカツプ形の研削砥石
の円筒状部分の肉厚を上記丸穴底部の周縁部の丸
み半径の許容値以下に設定してダイヤフラムを形
成するようにしたものである。
(Means and effects for solving the problem) The wall thickness of the cylindrical part of the straight cup-shaped grinding wheel for round hole machining is set to be less than the allowable value of the rounding radius of the periphery of the bottom of the round hole, and the diaphragm is It was designed so that it could be formed.
（実施例）
以下、本発明の一実施例を図面を参照して詳述
する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第２図は、本実施例のダイヤフラムの製造方法
に用いられる研削砥石を示すもので、この研削砥
石の本体部１は、円筒状に形成されて、いわゆる
ストレートカツプ形の研削砥石となつている。こ
の本体部１の肉厚Ｄは、0.25mm以下となつてい
る。この肉厚Ｄの大きさは、本実施例の研削砥石
によつて形成される丸穴底部の周縁部の丸み半径
の許容値以下に設定されている。そして、本体部
１の先端面２が研削作用面となつていて、この本
体部１の先端面２と反対側には軸３が同軸に連結
されている。しかして、本体部１は、ニツケル
（Ni）を結合剤としたダイヤモンド砥粒（Ｄ砥
粒）からなつている。 FIG. 2 shows a grinding wheel used in the diaphragm manufacturing method of this embodiment. The main body 1 of this grinding wheel is formed into a cylindrical shape, and is a so-called straight cup-shaped grinding wheel. . The wall thickness D of this main body portion 1 is 0.25 mm or less. The size of this wall thickness D is set to be less than or equal to the permissible value of the rounding radius of the peripheral edge of the bottom of the round hole formed by the grinding wheel of this embodiment. The distal end surface 2 of the main body section 1 serves as a grinding surface, and a shaft 3 is coaxially connected to the opposite side of the distal end surface 2 of the main body section 1. The main body 1 is made of diamond abrasive grains (D abrasive grains) using nickel (Ni) as a binder.
上記構成の研削砥石を用いてこの実施例のダイ
ヤフラムの製造方法について述べる。 A method for manufacturing the diaphragm of this example using the grinding wheel having the above configuration will be described.
第３図に示すように、シリコン単結晶基板４に
例えば、深さ２mm、直径７mmの丸穴５を穿設する
場合（この場合、丸穴５の底部の周縁部の丸み半
径の最大許容値は0.25mmに設定されている。）、軸
３を回転軸として矢印６方向に自転させると同時
に、点７を公転中心として矢印８方向に公転させ
る。このような研削砥石の遊星運動により所要の
丸穴５が形成されるが、このような丸穴５の加工
を何回も繰り返すと、加工に従つて本体部１の先
端部の周縁部が摩滅し丸みを帯びてくる。その結
果、第４図のように、ダイヤフラム９のコーナ部
つまりダイヤフラム９と側壁１０との交差部分１
１に丸みが生じる。しかし、本体部１の肉厚は
0.25mmであるので、交差部分１１の丸みの半径は
高々0.25mm以内におさまり、設計基準を満足させ
ることができる。 As shown in FIG. 3, when a round hole 5 with a depth of 2 mm and a diameter of 7 mm is bored in a silicon single crystal substrate 4 (in this case, the maximum allowable radius of the rounded edge of the bottom of the round hole 5 is is set to 0.25 mm), and rotates in the direction of arrow 6 with axis 3 as the rotation axis, and at the same time revolves in the direction of arrow 8 with point 7 as the center of revolution. The required round hole 5 is formed by such planetary motion of the grinding wheel, but if the round hole 5 is repeatedly machined many times, the peripheral edge of the tip of the main body 1 will wear out as the process progresses. It becomes rounded. As a result, as shown in FIG.
1 is rounded. However, the wall thickness of the main body part 1 is
Since it is 0.25 mm, the radius of the roundness of the intersection portion 11 is within 0.25 mm at most, and the design standard can be satisfied.
したがつて、本実施例のダイヤフラムの製造方
法においては、使用される研削砥石は、長期間連
続使用することによつて、先端が減耗しても、新
しい研削砥石と交換したり、形直し（Truing）
する必要がなく、寿命が極めて長いものとなる。 Therefore, in the diaphragm manufacturing method of this embodiment, even if the tip of the grinding wheel used is worn out due to long-term continuous use, it cannot be replaced with a new one or reshaped ( Truing)
There is no need to do so, and the lifespan is extremely long.
なお、上記実施例においては、本体部１の肉厚
は、0.25mmとしたが、これに制約されることな
く、丸穴底部のコーナ部分の丸み半径の許容値に
対応して適宜設定してよい。また、上記実施例に
おいては、研削砥石の砥粒としては、ダイヤモン
ド砥粒を用いているが、ボラゾン（窒化硼素）、
炭化珪素（Ｃ砥粒）等、加工条件に応じて任意に
選択してよい。 In the above embodiment, the wall thickness of the main body portion 1 was set to 0.25 mm, but it is not limited to this, and may be set as appropriate in accordance with the allowable value of the rounding radius of the corner portion of the bottom of the round hole. good. In the above embodiment, diamond abrasive grains are used as the abrasive grains of the grinding wheel, but borazone (boron nitride),
Silicon carbide (C abrasive grains) or the like may be arbitrarily selected depending on processing conditions.
本発明のダイヤフラムの製造方法は、使用する
研削砥石の肉厚を丸穴底部周縁部の丸み半径の許
容値以下にしているので、丸穴加工を連続的に行
うことにより研削砥石の先端が減耗しても、丸穴
底部のコーナ部の丸みの半径を常に許容範囲内に
おさめることができる。したがつて、研削砥石を
頻繁に形直ししたり、新しい研削砥石と交換する
煩雑さがなくなり、生産能率向上の一助となる。
In the method for manufacturing a diaphragm of the present invention, the wall thickness of the grinding wheel used is set to be less than the allowable radius of the rounded edge of the bottom of the round hole, so the tip of the grinding wheel is worn out by continuously machining the round hole. However, the radius of the corner of the bottom of the round hole can always be kept within the allowable range. Therefore, the trouble of frequently reshaping the grinding wheel or replacing it with a new one is eliminated, which helps improve production efficiency.
第１図は従来のダイヤフラムの製造に用いられ
ている研削砥石の要部切欠正面図、第２図は本発
明の一実施例のダイヤフラムの製造方法に用いら
れる研削砥石の要部切欠正面図、第３図は第２図
の研削砥石によるダイヤフラムの製造を示す平面
図、第４図は形成されたダイヤフラムの断面図で
ある。
１：本体部（円筒状部分）２：先端面、５：丸
穴、９：ダイヤフラム、１１：交差部分（周縁
部）。
FIG. 1 is a cutaway front view of a main part of a grinding wheel used in the production of a conventional diaphragm, and FIG. 2 is a cutaway front view of a main part of a grinding wheel used in a method of manufacturing a diaphragm according to an embodiment of the present invention. FIG. 3 is a plan view showing the manufacture of a diaphragm using the grinding wheel shown in FIG. 2, and FIG. 4 is a cross-sectional view of the formed diaphragm. 1: Main body part (cylindrical part) 2: Tip surface, 5: Round hole, 9: Diaphragm, 11: Intersection part (periphery part).
Claims (1)
形の研削砥石を遊星運動させてシリコン単結晶基
板に丸穴を加工することによりダイヤフラムを形
成するダイヤフラムの製造方法において、上記研
削砥石の円筒状部分の肉厚を上記丸穴底部周縁部
の丸み半径の許容値以下に設定することを特徴と
するダイヤフラムの製造方法。1 In a diaphragm manufacturing method in which a diaphragm is formed by machining a round hole in a silicon single crystal substrate by planetary motion of a straight cup-shaped grinding wheel whose tip end surface serves as a grinding surface, the cylindrical portion of the grinding wheel is A method of manufacturing a diaphragm, characterized in that the wall thickness is set to be less than or equal to the allowable radius of the rounded edge of the bottom of the round hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63295167A JPS63295167A (en) | 1988-12-01 |
| JPH0565313B2 true JPH0565313B2 (en) | 1993-09-17 |
Family
ID=14335160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10272288A Granted JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63295167A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5390740B2 (en) * | 2005-04-27 | 2014-01-15 | 株式会社ディスコ | Wafer processing method |
| JP2008130808A (en) * | 2006-11-21 | 2008-06-05 | Disco Abrasive Syst Ltd | Grinding method |
-
1988
- 1988-04-27 JP JP10272288A patent/JPS63295167A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63295167A (en) | 1988-12-01 |
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