JPS63295167A - Manufacture of diaphragm - Google Patents
Manufacture of diaphragmInfo
- Publication number
- JPS63295167A JPS63295167A JP10272288A JP10272288A JPS63295167A JP S63295167 A JPS63295167 A JP S63295167A JP 10272288 A JP10272288 A JP 10272288A JP 10272288 A JP10272288 A JP 10272288A JP S63295167 A JPS63295167 A JP S63295167A
- Authority
- JP
- Japan
- Prior art keywords
- round hole
- roundness
- diaphragm
- radius
- round
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 238000003754 machining Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 10
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Pressure Sensors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、半導体圧力センサのダイヤフラムの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method for manufacturing a diaphragm for a semiconductor pressure sensor.
（従来の技術）
近時、シリコン（Ｓｔ）単結晶基板に薄肉のダイヤフラ
ムを形成し、このダイヤ７′）ム上に逆導電性の不純物
を短冊状に拡散してピエゾ抵抗ゲージを形成した半導体
圧力センナが産業界の各分野に普及している。一般に、
この半導体圧カセ／すのダイヤフラムの加工は、化学的
エツチング法によシ行われている。しかし、この方法に
よれば、加工能率がすこぶる低いうえに、加工の再現性
に乏しく所要の加工精度を得ることが困難であった。(Prior art) Recently, semiconductors have been developed in which a thin diaphragm is formed on a silicon (St) single crystal substrate, and a piezoresistance gauge is formed by diffusing impurities of opposite conductivity into strips on this diaphragm. Pressure sensors have become widespread in various fields of industry. in general,
The processing of the diaphragm of this semiconductor pressure cassette is carried out by a chemical etching method. However, according to this method, the machining efficiency is extremely low, and the reproducibility of machining is poor, making it difficult to obtain the required machining accuracy.
そこで０例えば本出願人による出願である特願昭５７−
８７３０６号「ダイヤプラム製造方法」に開示されてい
るように、ダイヤプラムの加工を従来の化学的エツチン
グ法に代えて、研削砥石によシ行う試みがなされている
。この場合、使用される研削砥石としては１通常、第１
図に示すようなストレートカップ形のダイヤモンド砥石
ｑが用いられている。ところが、このようなストレート
カップ形の研削砥石を連続して用いると先端外縁部（ｑ
が破線で示すように次第に減耗し、所要の加工精度（例
えばダイヤ７−ｙムのコーナ部の丸みの半径が０．２５
ｍｍ以下）を達成することができなくなシ、先端が減耗
していない研削砥石と頻繁に交換せねばならない不具合
があった。Therefore, for example, the patent application filed in 1983 by the present applicant
As disclosed in No. 87306, "Method for Manufacturing Diaphragms," attempts have been made to process diaphragms using a grinding wheel instead of the conventional chemical etching method. In this case, the grinding wheel used is usually 1.
A straight cup-shaped diamond grindstone q as shown in the figure is used. However, when such a straight cup-shaped grinding wheel is used continuously, the outer edge of the tip (q
gradually wears out as shown by the broken line, and the required machining accuracy (for example, the radius of the corner of a 7-y diameter diamond is 0.25
mm or less), and the grinding wheel had to be replaced frequently with a grinding wheel whose tip was not worn out.
（発明が解決しようとする課題）
本発明は、上記事情を勘案してなされたもので、研削砥
石の先端部が減耗しても新しいものと交換する必要のな
いダイヤ７２ムの製造方法を提供することを目的とする
。(Problems to be Solved by the Invention) The present invention has been made in consideration of the above circumstances, and provides a method for manufacturing a diamond 72 wheel that does not require replacing the tip of the grinding wheel with a new one even if it wears out. The purpose is to
（課題を解決するための手段と作用）
丸穴加工を行うストレートカップ形の研削砥石の円筒状
部分の肉厚を上記丸穴底部の周縁部の丸み半径の許容値
以下に設定してダイヤフラムを形成するようにしたもの
である。(Means and effects for solving the problem) The wall thickness of the cylindrical part of the straight cup-shaped grinding wheel for round hole machining is set to be less than the allowable rounding radius of the periphery of the bottom of the round hole, and the diaphragm is It was designed so that it could be formed.
（実施例） 以下１本発明の一実施例を図面を参照して詳述する。(Example) An embodiment of the present invention will be described below in detail with reference to the drawings.
第２図は１本実施例のダイヤフラムの製造方法に用いら
れる研削砥石を示すもので、この研削砥石の本体部（１
）は１円筒状に形成されて、いわゆるストレートカップ
形の研削砥石となっている。この本体部（１）の肉厚り
は、 ０．２５ｎ＋以下となりている。FIG. 2 shows a grinding wheel used in the method of manufacturing a diaphragm of this embodiment.
) is formed into a cylindrical shape, and is a so-called straight cup-shaped grinding wheel. The wall thickness of this main body portion (1) is 0.25n+ or less.
この肉厚りの大きさは１本実施例の研削砥石によって形
成される丸穴底部の周縁部の丸み半径の許容値以下に設
定されている。そして０本体部（１）の先端面（２）が
研削作用面となっていて、この本体部（１）の先端面（
２）と反対側には軸（３）が同軸に連結されている。し
かして１本体部（１）は、ニッケル（ＮＯを結合剤とし
たダイヤモンド砥粒（Ｄ砥粒）からなりている。The size of this wall thickness is set to be less than or equal to the permissible value of the rounding radius of the peripheral edge of the bottom of the round hole formed by the grinding wheel of this embodiment. The tip surface (2) of the main body section (1) serves as a grinding surface;
A shaft (3) is coaxially connected to the opposite side of the shaft (2). The main body portion (1) is made of diamond abrasive grains (D abrasive grains) using nickel (NO) as a binder.
上記構成の研削砥石を用いてこの実施例のダイヤフラム
の製造方法について述べる。A method for manufacturing the diaphragm of this example using the grinding wheel having the above configuration will be described.
第３図に示すように、シリコン単結晶基板（４）に例え
ば、深さ２絽、直径７Ｂの丸穴（５）を穿設する場合（
この場合、丸穴（５）の底部の周縁部の丸み半径の最大
許容値は０゜２５Ｂに設定されている。）。As shown in FIG. 3, for example, when a round hole (5) with a depth of 2 cm and a diameter of 7 B is bored in a silicon single crystal substrate (4) (
In this case, the maximum permissible value of the rounding radius of the bottom peripheral edge of the round hole (5) is set to 0°25B. ).
軸（３）を回転軸として矢印（６）方向に自転させると
同時に１点（７）を公転中心として矢印（８）方向に公
転させる。このような研削砥石の遊星運動によシ所要の
丸穴（５）が形成されるが、このような丸穴（５）の加
工を何回も繰シ返すと、加工に従って本体部（１）の先
端部の周縁部が摩滅し丸みを帯びてくる。その結果、第
４図のように、ダイヤプラム（９）のコーナ部つｔｂダ
イヤフ２ム（９）と側壁部との交差部分ＩＫ丸みが生じ
る。しかし１本体部（１）の肉厚は０．２５１１１１で
あるので、交差部分αυの丸みの半径は高々０．２５ａ
以内におさまシ、設計基準を満足させることができる。It rotates in the direction of arrow (6) about axis (3) and at the same time revolves in the direction of arrow (8) about one point (7) as the center of revolution. The required round hole (5) is formed by such planetary motion of the grinding wheel, but if the machining of the round hole (5) is repeated many times, the main body (1) The peripheral edge of the tip becomes worn and rounded. As a result, as shown in FIG. 4, a corner portion of the diaphragm (9) and the intersection portion IK of the tb diaphragm (9) and the side wall portion are rounded. However, since the thickness of the main body part (1) is 0.251111, the radius of the roundness of the intersection αυ is at most 0.25a.
Within a short period of time, the design standards can be satisfied.
したがって１本実施例のダイヤ７２ムの製造方法におい
ては、使用される研削砥石は、長期間連続使用すること
によって、先端が減耗しても、新しい研削砥石と交換し
たシ、形直しくＴｒｕｉｎｇ）する必要がなく、寿命が
極めて長いものとなる。Therefore, in the method for manufacturing the diamond 72 wheel of this embodiment, even if the tip of the grinding wheel used is worn out due to continuous use for a long period of time, it can be replaced with a new one and reshaped. There is no need to do so, and the lifespan is extremely long.
なお、上記実施例においては１本体部（１）の肉厚は、
０．２５１Ｆ１Ｂとしたが、これに制約されることなく
。In addition, in the above embodiment, the wall thickness of one main body portion (1) is as follows:
Although it was set to 0.251F1B, it is not limited to this.
丸穴底部のコーナ部分の丸み半径の許容値に対応して適
宜設定してよい。また、上記実施例においては、研削砥
石の砥粒としては、ダイヤモンド砥粒を用いているが、
ボラゾン（窒化硼素）、炭化珪素（Ｃ砥粒）等、加工条
件に応じて任意に選択してよい。It may be set as appropriate depending on the allowable value of the rounding radius of the corner portion of the bottom of the round hole. In addition, in the above embodiment, diamond abrasive grains are used as the abrasive grains of the grinding wheel, but
Borazone (boron nitride), silicon carbide (C abrasive grains), etc. may be arbitrarily selected depending on processing conditions.
本発明のダイヤフラムの製造方法は、使用する研削砥石
の肉厚を丸穴底部周縁部の丸み半径の許容値以下にして
いるので、丸穴加工を連続的に行うことによシ研削砥石
の先端が減耗しても、丸穴底部のコーナ部の丸みの半径
を常に許容範囲内におさめることができる。したがって
、研削砥石を頻繁く形直ししたり、新しい研削砥石と交
換する煩雑さがなくなり、生産能率向上の一助となる。In the method for manufacturing a diaphragm of the present invention, since the wall thickness of the grinding wheel used is set to be less than the allowable value of the rounding radius of the bottom periphery of the round hole, the tip of the grinding wheel is Even if the hole is worn out, the radius of the corner at the bottom of the hole can always be kept within the allowable range. Therefore, the trouble of frequently reshaping the grinding wheel or replacing it with a new one is eliminated, which helps improve production efficiency.
第１図は従来のダイヤフラムの製造に用いられている研
削砥石の要部切欠正面図、第２図は本発明の一実施例の
ダイヤプラムの製造方法に用いられる研削砥石の要部切
欠正面図、第３図は第２図の研削砥石によるダイヤフラ
ムの製造を示す平面図、第４図は形成されたダイヤフラ
ムの断面図である。
（１）二本体部（円筒状部分）、（２Ｂ先端面。
（５）：丸 穴、 （９） ：ダイ
ヤフラム。
（ｌυ：交差部分（周縁部）。
−代理人 弁理士 則 近 憲 佑
同 松山光之FIG. 1 is a cutaway front view of a main part of a grinding wheel used in conventional diaphragm manufacturing, and FIG. 2 is a cutaway front view of a main part of a grinding wheel used in a method of manufacturing a diaphragm according to an embodiment of the present invention. 3 is a plan view showing the manufacture of the diaphragm using the grinding wheel shown in FIG. 2, and FIG. 4 is a sectional view of the formed diaphragm. (1) Two main body parts (cylindrical part), (2B tip surface. (5): Round hole, (9): Diaphragm. (lυ: Intersecting part (periphery part). - Agent Patent attorney Noriyuki Chika Mitsuyuki Matsuyama
Claims (1)
石を遊星運動させてシリコン単結晶基板に丸穴を加工す
ることによりダイヤフラムを形成するダイヤフラムの製
造方法において、上記研削砥石の円筒状部分の肉厚を上
記丸穴底部周縁部の丸み半径の許容値以下に設定するこ
とを特徴とするダイヤフラムの製造方法。In a diaphragm manufacturing method in which a diaphragm is formed by machining a round hole in a silicon single crystal substrate by planetary motion of a straight cup-shaped grinding wheel whose tip surface serves as a grinding surface, the thickness of the cylindrical portion of the grinding wheel is A method of manufacturing a diaphragm, characterized in that the thickness is set to be less than or equal to the allowable radius of the rounded edge of the bottom of the round hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10272288A JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63295167A true JPS63295167A (en) | 1988-12-01 |
| JPH0565313B2 JPH0565313B2 (en) | 1993-09-17 |
Family
ID=14335160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10272288A Granted JPS63295167A (en) | 1988-04-27 | 1988-04-27 | Manufacture of diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63295167A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019461A (en) * | 2005-04-27 | 2007-01-25 | Disco Abrasive Syst Ltd | Method for processing wafer and wafer |
| JP2008130808A (en) * | 2006-11-21 | 2008-06-05 | Disco Abrasive Syst Ltd | Grinding method |
-
1988
- 1988-04-27 JP JP10272288A patent/JPS63295167A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019461A (en) * | 2005-04-27 | 2007-01-25 | Disco Abrasive Syst Ltd | Method for processing wafer and wafer |
| JP2008130808A (en) * | 2006-11-21 | 2008-06-05 | Disco Abrasive Syst Ltd | Grinding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0565313B2 (en) | 1993-09-17 |
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