JPH0565069B2 - - Google Patents
Info
- Publication number
- JPH0565069B2 JPH0565069B2 JP61081726A JP8172686A JPH0565069B2 JP H0565069 B2 JPH0565069 B2 JP H0565069B2 JP 61081726 A JP61081726 A JP 61081726A JP 8172686 A JP8172686 A JP 8172686A JP H0565069 B2 JPH0565069 B2 JP H0565069B2
- Authority
- JP
- Japan
- Prior art keywords
- superconducting
- signal line
- signal
- circuit
- ground plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081726A JPS62237778A (ja) | 1986-04-08 | 1986-04-08 | 3次元ジヨセフソン接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081726A JPS62237778A (ja) | 1986-04-08 | 1986-04-08 | 3次元ジヨセフソン接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62237778A JPS62237778A (ja) | 1987-10-17 |
| JPH0565069B2 true JPH0565069B2 (cg-RX-API-DMAC10.html) | 1993-09-16 |
Family
ID=13754416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61081726A Granted JPS62237778A (ja) | 1986-04-08 | 1986-04-08 | 3次元ジヨセフソン接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62237778A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4977328B2 (ja) * | 2005-03-28 | 2012-07-18 | 日本電気株式会社 | 超伝導ランダムアクセスメモリおよびその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845194B2 (ja) * | 1980-07-11 | 1983-10-07 | 日本電信電話株式会社 | 超伝導集積回路およびその製法 |
| JPS58147181A (ja) * | 1982-02-26 | 1983-09-01 | Fujitsu Ltd | ジヨセフソン集積回路装置 |
-
1986
- 1986-04-08 JP JP61081726A patent/JPS62237778A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62237778A (ja) | 1987-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5093708A (en) | Multilayer integrated circuit module | |
| JP2606845B2 (ja) | 半導体集積回路 | |
| EP0018489A2 (en) | A module for an array of integrated circuit chips, accomodating discretionary fly wire connections | |
| JPH0362934A (ja) | 集積回路パツケージ | |
| US5672909A (en) | Interdigitated wirebond programmable fixed voltage planes | |
| JP3989038B2 (ja) | 半導体集積回路装置 | |
| JP3171172B2 (ja) | 混成集積回路 | |
| JPS6318697A (ja) | 多層配線基板 | |
| JPH0565069B2 (cg-RX-API-DMAC10.html) | ||
| US4935637A (en) | Linear element array with wire bonding arrangement | |
| JP2755239B2 (ja) | 半導体装置用パッケージ | |
| JPH0545075B2 (cg-RX-API-DMAC10.html) | ||
| JPS63293941A (ja) | 半導体集積回路装置 | |
| CN220173720U (zh) | 一种衬底结构及超导量子芯片 | |
| JPH03274764A (ja) | 半導体集積回路装置 | |
| JPH0728133B2 (ja) | 回路基板 | |
| JPH04338683A (ja) | 超伝導集積回路素子とその実装方法 | |
| US7358549B2 (en) | Multi-layered metal routing technique | |
| JPS63200578A (ja) | 超伝導回路装置 | |
| JPS6317346B2 (cg-RX-API-DMAC10.html) | ||
| JPS6356940A (ja) | 集積回路装置 | |
| JPH0680670B2 (ja) | 半導体集積回路装置 | |
| JPS6020239Y2 (ja) | バブルメモリチツプ | |
| JPH03169073A (ja) | 半導体集積回路装置 | |
| JPH0719778B2 (ja) | 半導体集積回路装置 |