JPH0564990B2 - - Google Patents

Info

Publication number
JPH0564990B2
JPH0564990B2 JP8783158A JP8315887A JPH0564990B2 JP H0564990 B2 JPH0564990 B2 JP H0564990B2 JP 8783158 A JP8783158 A JP 8783158A JP 8315887 A JP8315887 A JP 8315887A JP H0564990 B2 JPH0564990 B2 JP H0564990B2
Authority
JP
Japan
Prior art keywords
epoxy
silicone oil
modified silicone
resin composition
semiconductor encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8783158A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6346216A (ja
Inventor
Ichiro Takahashi
Hiromi Ito
Goro Okamoto
Ko Shimomura
Kazuo Okabashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPS6346216A publication Critical patent/JPS6346216A/ja
Publication of JPH0564990B2 publication Critical patent/JPH0564990B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP8315887A 1986-04-11 1987-04-03 半導体封止用エポキシ樹脂組成物の製法 Granted JPS6346216A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8455386 1986-04-11
JP61-84553 1986-04-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP21125294A Division JP2699885B2 (ja) 1994-09-05 1994-09-05 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6346216A JPS6346216A (ja) 1988-02-27
JPH0564990B2 true JPH0564990B2 (enrdf_load_stackoverflow) 1993-09-16

Family

ID=13833833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8315887A Granted JPS6346216A (ja) 1986-04-11 1987-04-03 半導体封止用エポキシ樹脂組成物の製法

Country Status (1)

Country Link
JP (1) JPS6346216A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0723425B2 (ja) * 1986-07-14 1995-03-15 株式会社東芝 樹脂封止型半導体装置
JPS644612A (en) * 1987-06-25 1989-01-09 Matsushita Electric Works Ltd Preparation of phenol resin
JP2608107B2 (ja) * 1988-06-28 1997-05-07 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JP2712425B2 (ja) * 1988-11-22 1998-02-10 大日本インキ化学工業株式会社 硬化性樹脂組成物
JPH02173025A (ja) * 1988-12-26 1990-07-04 Sumitomo Bakelite Co Ltd シリコーン変性フェノール樹脂
JPH02141060U (enrdf_load_stackoverflow) * 1989-04-27 1990-11-27
JP2723348B2 (ja) * 1990-03-23 1998-03-09 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JP4765310B2 (ja) * 2004-12-24 2011-09-07 住友ベークライト株式会社 樹脂封止型半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993729A (ja) * 1982-11-22 1984-05-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の製造方法
JPS6058425A (ja) * 1983-09-07 1985-04-04 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS6173725A (ja) * 1984-09-20 1986-04-15 Denki Kagaku Kogyo Kk エポキシ樹脂組成物
JPS61163927A (ja) * 1985-01-16 1986-07-24 Denki Kagaku Kogyo Kk エポキシ樹脂組成物
JPS6250324A (ja) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JPS62119224A (ja) * 1985-11-19 1987-05-30 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPS62174222A (ja) * 1986-01-28 1987-07-31 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料

Also Published As

Publication number Publication date
JPS6346216A (ja) 1988-02-27

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