JPS644612A - Preparation of phenol resin - Google Patents
Preparation of phenol resinInfo
- Publication number
- JPS644612A JPS644612A JP15906287A JP15906287A JPS644612A JP S644612 A JPS644612 A JP S644612A JP 15906287 A JP15906287 A JP 15906287A JP 15906287 A JP15906287 A JP 15906287A JP S644612 A JPS644612 A JP S644612A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- silicone polymer
- epoxy
- methylimidazole
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Abstract
PURPOSE:To obtain a phenol resin giving a cured substance whose water resistance is improved, by reacting a phenol resin with an epoxy-modified silicone polymer. CONSTITUTION:A phenol resin is reacted with an epoxy-modified silicone polymer by melting the phenol resin and a reactive catalyst (e.g., 2-methylimidazole) and adding the silicone polymer thereto to react with each other under heating. As the ratio of these cpd. to be used, 0.0001-0.001mol. of 2-methylimidazole and 0.05-0.5mol. of epoxy groups of the silicone polymer per mol. of the OH group of the phenol resin are used. The reaction temp. and time are 100-160 deg.C and 3-60min, respectively. The phenol resin thus obtd. can be cured by conventional methods and the cured substance has excellent water resistance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15906287A JPS644612A (en) | 1987-06-25 | 1987-06-25 | Preparation of phenol resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15906287A JPS644612A (en) | 1987-06-25 | 1987-06-25 | Preparation of phenol resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS644612A true JPS644612A (en) | 1989-01-09 |
Family
ID=15685384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15906287A Pending JPS644612A (en) | 1987-06-25 | 1987-06-25 | Preparation of phenol resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS644612A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0430254A2 (en) * | 1989-11-30 | 1991-06-05 | Dow Corning Toray Silicone Company, Limited | Curable epoxy resin compositions |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993729A (en) * | 1982-11-22 | 1984-05-30 | Hitachi Ltd | Silicone phenolic compound, its preparation and composition |
JPS59172541A (en) * | 1983-03-23 | 1984-09-29 | Sumitomo Bakelite Co Ltd | Mold-releasable resin composition |
JPS6250324A (en) * | 1985-08-29 | 1987-03-05 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
JPS6346216A (en) * | 1986-04-11 | 1988-02-27 | Mitsubishi Electric Corp | Epoxy resin composition for semiconductor sealing use |
-
1987
- 1987-06-25 JP JP15906287A patent/JPS644612A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993729A (en) * | 1982-11-22 | 1984-05-30 | Hitachi Ltd | Silicone phenolic compound, its preparation and composition |
JPS59172541A (en) * | 1983-03-23 | 1984-09-29 | Sumitomo Bakelite Co Ltd | Mold-releasable resin composition |
JPS6250324A (en) * | 1985-08-29 | 1987-03-05 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
JPS6346216A (en) * | 1986-04-11 | 1988-02-27 | Mitsubishi Electric Corp | Epoxy resin composition for semiconductor sealing use |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0430254A2 (en) * | 1989-11-30 | 1991-06-05 | Dow Corning Toray Silicone Company, Limited | Curable epoxy resin compositions |
EP0430254A3 (en) * | 1989-11-30 | 1992-07-08 | Dow Corning Toray Silicone Company, Limited | Curable epoxy resin compositions |
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