JPH0564479B2 - - Google Patents
Info
- Publication number
- JPH0564479B2 JPH0564479B2 JP17228484A JP17228484A JPH0564479B2 JP H0564479 B2 JPH0564479 B2 JP H0564479B2 JP 17228484 A JP17228484 A JP 17228484A JP 17228484 A JP17228484 A JP 17228484A JP H0564479 B2 JPH0564479 B2 JP H0564479B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- metal plate
- circuit board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17228484A JPS6150350A (ja) | 1984-08-18 | 1984-08-18 | 混成集積回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17228484A JPS6150350A (ja) | 1984-08-18 | 1984-08-18 | 混成集積回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6150350A JPS6150350A (ja) | 1986-03-12 |
| JPH0564479B2 true JPH0564479B2 (zh) | 1993-09-14 |
Family
ID=15939070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17228484A Granted JPS6150350A (ja) | 1984-08-18 | 1984-08-18 | 混成集積回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150350A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100995A (ja) * | 1987-10-14 | 1989-04-19 | Denki Kagaku Kogyo Kk | 金属ベース回路基板の多量製造方法 |
| JP2585643B2 (ja) * | 1987-11-19 | 1997-02-26 | 電気化学工業株式会社 | 金属ベース回路基板の多量製造方法 |
| FR2835690A1 (fr) * | 2002-02-07 | 2003-08-08 | Possehl Electronic France Sa | Procede de realisation industrielle d'elements de dissipation thermique pour support de semi-conducteurs a partir d'une bande de metal |
| JP4488733B2 (ja) | 2003-12-24 | 2010-06-23 | 三洋電機株式会社 | 回路基板の製造方法および混成集積回路装置の製造方法。 |
| JP4845090B2 (ja) * | 2005-07-28 | 2011-12-28 | オンセミコンダクター・トレーディング・リミテッド | 回路装置の製造方法 |
| JP6581861B2 (ja) * | 2015-09-18 | 2019-09-25 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
-
1984
- 1984-08-18 JP JP17228484A patent/JPS6150350A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6150350A (ja) | 1986-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4121044A (en) | Flexible through-contacted printed circuits | |
| US3977074A (en) | Double sided printed circuit board and method for making same | |
| JPH0564479B2 (zh) | ||
| JP2001327043A (ja) | 端子溶接型積層バスバー | |
| JPS5930555Y2 (ja) | プリント基板 | |
| JP2567661B2 (ja) | 混成集積回路 | |
| JPS6235209Y2 (zh) | ||
| JPH0217954B2 (zh) | ||
| WO2021095421A1 (ja) | 配線回路基板およびその製造方法 | |
| JPH0249651Y2 (zh) | ||
| JP2739123B2 (ja) | 電子部品搭載用基板の製造方法 | |
| JP4100998B2 (ja) | プリント基板とフラットケーブルとの接続部及び接続方法 | |
| JPS6021594A (ja) | 回路基板の製造方法 | |
| JPS6141272Y2 (zh) | ||
| JPS59106176A (ja) | プリント基板 | |
| JPS58216493A (ja) | プリント回路用積層基板およびこの積層基板を使用したフレキシブル電気回路板の製造方法 | |
| JPS60144991A (ja) | 金属ベ−ス回路板 | |
| JPS604289A (ja) | 配線基板 | |
| JPH0119815Y2 (zh) | ||
| JPH03283484A (ja) | 大電流回路基板 | |
| JPH04239794A (ja) | 回路基板の製造方法 | |
| JPS59194421A (ja) | チツプ型電子部品及びその製造方法 | |
| JPH0327588A (ja) | 回路基板の製造方法 | |
| JPS5961992A (ja) | スルホ−ルプリント配線板の製造方法 | |
| JPH02137391A (ja) | 金属板ベースプリント配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |