JPH0563938B2 - - Google Patents

Info

Publication number
JPH0563938B2
JPH0563938B2 JP3155719A JP15571991A JPH0563938B2 JP H0563938 B2 JPH0563938 B2 JP H0563938B2 JP 3155719 A JP3155719 A JP 3155719A JP 15571991 A JP15571991 A JP 15571991A JP H0563938 B2 JPH0563938 B2 JP H0563938B2
Authority
JP
Japan
Prior art keywords
molds
outside air
resin
mold
air blocking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3155719A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04350949A (ja
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP15571991A priority Critical patent/JPH04350949A/ja
Priority to GB9418909A priority patent/GB2280144B/en
Priority to GB9200609A priority patent/GB2252746B/en
Priority to MYPI92000061A priority patent/MY108182A/en
Priority to NL9200089A priority patent/NL194666C/nl
Priority to KR1019920000661A priority patent/KR920015493A/ko
Publication of JPH04350949A publication Critical patent/JPH04350949A/ja
Publication of JPH0563938B2 publication Critical patent/JPH0563938B2/ja
Priority to US08/173,150 priority patent/US5435953A/en
Priority to US08/273,025 priority patent/US5507633A/en
Priority to HK181095A priority patent/HK181095A/xx
Priority to HK180995A priority patent/HK180995A/xx
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP15571991A 1991-01-17 1991-05-28 電子部品の樹脂封止成形装置 Granted JPH04350949A (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP15571991A JPH04350949A (ja) 1991-05-28 1991-05-28 電子部品の樹脂封止成形装置
GB9418909A GB2280144B (en) 1991-01-17 1992-01-10 Apparatus for molding resin to seal an electronic part
GB9200609A GB2252746B (en) 1991-01-17 1992-01-10 A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
MYPI92000061A MY108182A (en) 1991-01-17 1992-01-15 A method of molding resin sealing of semiconductor device and apparatus thereof
KR1019920000661A KR920015493A (ko) 1991-01-17 1992-01-17 반도체 장치의 수지 봉지 성형방법 및 장치
NL9200089A NL194666C (nl) 1991-01-17 1992-01-17 Werkwijze en inrichting voor het door persgieten in kunsthars insluiten van een elektronisch deel.
US08/173,150 US5435953A (en) 1991-01-17 1993-12-21 Method of molding resin for sealing an electronic device
US08/273,025 US5507633A (en) 1991-01-17 1994-07-08 Resin molding apparatus for sealing an electronic device
HK181095A HK181095A (en) 1991-01-17 1995-11-30 A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
HK180995A HK180995A (en) 1991-01-17 1995-11-30 Apparatus for molding resin to seal an electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15571991A JPH04350949A (ja) 1991-05-28 1991-05-28 電子部品の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPH04350949A JPH04350949A (ja) 1992-12-04
JPH0563938B2 true JPH0563938B2 (cs) 1993-09-13

Family

ID=15611995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15571991A Granted JPH04350949A (ja) 1991-01-17 1991-05-28 電子部品の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JPH04350949A (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227435A (ja) * 1983-06-08 1984-12-20 Mitsubishi Metal Corp トランスフア成形用金型
JPH0648842Y2 (ja) * 1986-10-09 1994-12-12 三菱電機株式会社 半導体装置の樹脂封止装置

Also Published As

Publication number Publication date
JPH04350949A (ja) 1992-12-04

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Legal Events

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