JPH0562034B2 - - Google Patents
Info
- Publication number
- JPH0562034B2 JPH0562034B2 JP62050342A JP5034287A JPH0562034B2 JP H0562034 B2 JPH0562034 B2 JP H0562034B2 JP 62050342 A JP62050342 A JP 62050342A JP 5034287 A JP5034287 A JP 5034287A JP H0562034 B2 JPH0562034 B2 JP H0562034B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- alumina ceramics
- bonding
- metal
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62050342A JPS63220987A (ja) | 1987-03-06 | 1987-03-06 | アルミニウム及びアルミナセラミツクスの拡散接合法 |
US07/163,724 US4838474A (en) | 1987-03-06 | 1988-03-03 | Method of diffusion bonding of aluminum or alumina ceramics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62050342A JPS63220987A (ja) | 1987-03-06 | 1987-03-06 | アルミニウム及びアルミナセラミツクスの拡散接合法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2154064A Division JPH0649618B2 (ja) | 1990-06-14 | 1990-06-14 | アルミニウムまたはアルミナセラミックスの拡散接合法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63220987A JPS63220987A (ja) | 1988-09-14 |
JPH0562034B2 true JPH0562034B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-07 |
Family
ID=12856244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62050342A Granted JPS63220987A (ja) | 1987-03-06 | 1987-03-06 | アルミニウム及びアルミナセラミツクスの拡散接合法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4838474A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
JP (1) | JPS63220987A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004045856B4 (de) * | 2003-09-26 | 2007-07-12 | Smc Corp. | Verfahren zur Verbindung von Druckgusselementen aus Aluminiumlegierung |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2651847B2 (ja) * | 1988-08-08 | 1997-09-10 | スカイアルミニウム株式会社 | セラミックス接合用アルミニウム合金 |
US4988036A (en) * | 1990-04-09 | 1991-01-29 | General Motors Corporation | Vacuum braze cycle for clad aluminum sheet |
JP3364402B2 (ja) * | 1996-01-26 | 2003-01-08 | 日本特殊陶業株式会社 | Al金属接合体 |
JPH10148106A (ja) * | 1996-11-19 | 1998-06-02 | Fuji Oozx Inc | アルミニウム製内燃機関用タペット及びその製法 |
JP3987201B2 (ja) * | 1998-05-01 | 2007-10-03 | 日本碍子株式会社 | 接合体の製造方法 |
US6427904B1 (en) | 1999-01-29 | 2002-08-06 | Clad Metals Llc | Bonding of dissimilar metals |
US6723279B1 (en) * | 1999-03-15 | 2004-04-20 | Materials And Electrochemical Research (Mer) Corporation | Golf club and other structures, and novel methods for making such structures |
US6780794B2 (en) | 2000-01-20 | 2004-08-24 | Honeywell International Inc. | Methods of bonding physical vapor deposition target materials to backing plate materials |
US6698647B1 (en) * | 2000-03-10 | 2004-03-02 | Honeywell International Inc. | Aluminum-comprising target/backing plate structures |
US20050106794A1 (en) * | 2002-03-26 | 2005-05-19 | Fuji Electric Holdings Co., Ltd. | Method of manufacturing a semiconductor device |
US20060162849A1 (en) * | 2003-06-13 | 2006-07-27 | Joo-Hwan Han | Method of joining ceramics: reaction diffusion-bonding |
JP4008401B2 (ja) * | 2003-09-22 | 2007-11-14 | 日本碍子株式会社 | 基板載置台の製造方法 |
US20070077455A1 (en) * | 2005-09-30 | 2007-04-05 | Battelle Memorial Institute | Brazing techniques for dense high-fired alumina |
JP2007245219A (ja) * | 2006-03-17 | 2007-09-27 | Taiheiyo Cement Corp | アルミニウム基複合材料の接合方法およびアルミニウム基複合材料接合体 |
JP5417638B2 (ja) * | 2007-09-21 | 2014-02-19 | Smc株式会社 | 流体の流路構造を備える流体圧機器及びその製造方法 |
JP5724273B2 (ja) * | 2009-10-22 | 2015-05-27 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法及びヒートシンク付パワーモジュール用基板の製造方法 |
WO2011049067A1 (ja) | 2009-10-22 | 2011-04-28 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法及びヒートシンク付パワーモジュール用基板の製造方法 |
JP2013059788A (ja) * | 2011-09-13 | 2013-04-04 | Yazaki Corp | 金属接続方法 |
US9624137B2 (en) * | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
CN102699467A (zh) * | 2012-06-25 | 2012-10-03 | 镇江忆诺唯记忆合金有限公司 | 一种预置镁基非晶态中间层的zl203铝合金焊接新方法 |
US9383143B2 (en) | 2013-09-26 | 2016-07-05 | Micro Cooling Concepts, Inc. | Metallic thin-film bonding and alloy generation |
WO2015060837A1 (en) * | 2013-10-23 | 2015-04-30 | Hewlett-Packard Development Company, L.P. | Multi-layered metal |
US9969654B2 (en) * | 2014-01-24 | 2018-05-15 | United Technologies Corporation | Method of bonding a metallic component to a non-metallic component using a compliant material |
JP6696215B2 (ja) * | 2015-04-16 | 2020-05-20 | 三菱マテリアル株式会社 | 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法 |
WO2016167217A1 (ja) * | 2015-04-16 | 2016-10-20 | 三菱マテリアル株式会社 | 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法 |
JP2018184852A (ja) * | 2017-04-25 | 2018-11-22 | 日立オートモティブシステムズ株式会社 | ピストン |
CN111566074B (zh) * | 2018-01-25 | 2022-04-22 | 三菱综合材料株式会社 | 铜-陶瓷接合体、绝缘电路基板及铜-陶瓷接合体的制造方法、绝缘电路基板的制造方法 |
JP7192451B2 (ja) | 2018-01-25 | 2022-12-20 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
WO2020044590A1 (ja) | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1485051A (en) * | 1974-01-04 | 1977-09-08 | Fulmer Res Inst Ltd | Diffusion bonding of aluminium alloy parts |
JPS5641347A (en) * | 1979-09-13 | 1981-04-18 | Furukawa Alum Co Ltd | Aluminum alloy clad for vacuum brazing |
JPS57184574A (en) * | 1981-05-08 | 1982-11-13 | Mitsubishi Heavy Ind Ltd | Diffusion brazing method for al or al alloy |
US4890784A (en) * | 1983-03-28 | 1990-01-02 | Rockwell International Corporation | Method for diffusion bonding aluminum |
US4552301A (en) * | 1984-05-17 | 1985-11-12 | U.S. Philips Corporation | Method of bonding ceramic components together or to metallic components |
JPS6171173A (ja) * | 1984-09-14 | 1986-04-12 | Nippon Denso Co Ltd | アルミニウム熱交換器の製造方法 |
US4635842A (en) * | 1985-01-24 | 1987-01-13 | Kaiser Aluminum & Chemical Corporation | Process for manufacturing clad aluminum-lithium alloys |
JPS6270272A (ja) * | 1985-09-20 | 1987-03-31 | 新明和工業株式会社 | セラミツクスの接合構造 |
-
1987
- 1987-03-06 JP JP62050342A patent/JPS63220987A/ja active Granted
-
1988
- 1988-03-03 US US07/163,724 patent/US4838474A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004045856B4 (de) * | 2003-09-26 | 2007-07-12 | Smc Corp. | Verfahren zur Verbindung von Druckgusselementen aus Aluminiumlegierung |
Also Published As
Publication number | Publication date |
---|---|
JPS63220987A (ja) | 1988-09-14 |
US4838474A (en) | 1989-06-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |