JPS57184574A - Diffusion brazing method for al or al alloy - Google Patents
Diffusion brazing method for al or al alloyInfo
- Publication number
- JPS57184574A JPS57184574A JP6827781A JP6827781A JPS57184574A JP S57184574 A JPS57184574 A JP S57184574A JP 6827781 A JP6827781 A JP 6827781A JP 6827781 A JP6827781 A JP 6827781A JP S57184574 A JPS57184574 A JP S57184574A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- atoms
- eutectic
- joining
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
Abstract
PURPOSE:To join Al or Al alloy by diffusion-brazing by using a foil of a material which causes eutectic reaction with Al as an insert material, and heating the entire part of a joint to the eutectic point or above. CONSTITUTION:The above-described insert material (e.g.; Cu, Ag, etc.) 3 is sandwiched between joining materials 1 and 2 of Al or Al alloy, and the entire part of the joint is heated in a vacuum atmosphere (or an inert gaseous atmosphere or the atmospheric air). As a result, the atoms of the materials 1, 2 and the atoms of the material 3 are diffused mutually and an eutectic compsn. alloy is formed at the joining interface. This eutectic compsn. alloy has a lower m.p. than that of the materials 1, 2, and therefore if the entire part of the joint is heated to the eutectic point or above, for example, to around 600 deg.C, the eutectic compsn. alloy melts. As a result, the quantity of the atoms of the material 3 in the molten layer is decreased by the diffusion of the atoms of the material 3 from the molten layer to the joining materials and since the concn. of the atoms is maintained at the concn. of the liquidus line at that temp., the solid- liquid interface is moved in the direction of the molten layer, by which isothermal solidification is caused, and this completes the joining. Here, 4 in the figure denotes a vacuum chamber, 6 a shielding plate and 7 a heater respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6827781A JPS57184574A (en) | 1981-05-08 | 1981-05-08 | Diffusion brazing method for al or al alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6827781A JPS57184574A (en) | 1981-05-08 | 1981-05-08 | Diffusion brazing method for al or al alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57184574A true JPS57184574A (en) | 1982-11-13 |
Family
ID=13369097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6827781A Pending JPS57184574A (en) | 1981-05-08 | 1981-05-08 | Diffusion brazing method for al or al alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57184574A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838474A (en) * | 1987-03-06 | 1989-06-13 | National Research Institute For Metals | Method of diffusion bonding of aluminum or alumina ceramics |
| US5476725A (en) * | 1991-03-18 | 1995-12-19 | Aluminum Company Of America | Clad metallurgical products and methods of manufacture |
| US6326088B1 (en) * | 1996-08-10 | 2001-12-04 | Rolf Mayer | Diffusion-soldered joint and method for making diffusion-soldered joints |
| JP2010184284A (en) * | 2009-02-13 | 2010-08-26 | Nissan Motor Co Ltd | Method and structure for joining aluminum base material |
| CN110098312A (en) * | 2019-04-11 | 2019-08-06 | 中国科学院上海硅酸盐研究所 | A kind of connection method being segmented thermoelectric material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128557A (en) * | 1974-09-04 | 1976-03-10 | Honda Motor Co Ltd | ARUMINIUMUKEIKEIGOKINBUZAITOHAGANETONOKOSHITSUISHUKINZOKUBUZAI NO SET SUGOHOHO |
| JPS51112455A (en) * | 1974-11-15 | 1976-10-04 | Ass Eng Ltd | Connected structure and method of connecting same |
| JPS543460A (en) * | 1977-06-09 | 1979-01-11 | Hitachi Ltd | Self-exciting semiconductor switch circuit |
-
1981
- 1981-05-08 JP JP6827781A patent/JPS57184574A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128557A (en) * | 1974-09-04 | 1976-03-10 | Honda Motor Co Ltd | ARUMINIUMUKEIKEIGOKINBUZAITOHAGANETONOKOSHITSUISHUKINZOKUBUZAI NO SET SUGOHOHO |
| JPS51112455A (en) * | 1974-11-15 | 1976-10-04 | Ass Eng Ltd | Connected structure and method of connecting same |
| JPS543460A (en) * | 1977-06-09 | 1979-01-11 | Hitachi Ltd | Self-exciting semiconductor switch circuit |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838474A (en) * | 1987-03-06 | 1989-06-13 | National Research Institute For Metals | Method of diffusion bonding of aluminum or alumina ceramics |
| US5476725A (en) * | 1991-03-18 | 1995-12-19 | Aluminum Company Of America | Clad metallurgical products and methods of manufacture |
| US5669436A (en) * | 1991-03-18 | 1997-09-23 | Aluminum Company Of America | Method of continuously casting composite strip |
| US6326088B1 (en) * | 1996-08-10 | 2001-12-04 | Rolf Mayer | Diffusion-soldered joint and method for making diffusion-soldered joints |
| JP2010184284A (en) * | 2009-02-13 | 2010-08-26 | Nissan Motor Co Ltd | Method and structure for joining aluminum base material |
| CN110098312A (en) * | 2019-04-11 | 2019-08-06 | 中国科学院上海硅酸盐研究所 | A kind of connection method being segmented thermoelectric material |
| CN110098312B (en) * | 2019-04-11 | 2021-08-31 | 中国科学院上海硅酸盐研究所 | Connection method of segmented thermoelectric material |
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