JPS5597887A - Diffusion-bonding method - Google Patents

Diffusion-bonding method

Info

Publication number
JPS5597887A
JPS5597887A JP298379A JP298379A JPS5597887A JP S5597887 A JPS5597887 A JP S5597887A JP 298379 A JP298379 A JP 298379A JP 298379 A JP298379 A JP 298379A JP S5597887 A JPS5597887 A JP S5597887A
Authority
JP
Japan
Prior art keywords
bonding
parts
materials
members
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP298379A
Other languages
Japanese (ja)
Inventor
Akiomi Kono
Toshimi Sasaki
Akihiko Yamamoto
Hiroshi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP298379A priority Critical patent/JPS5597887A/en
Publication of JPS5597887A publication Critical patent/JPS5597887A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To form radii in bonding parts and improve bonding strength by placing low-melting-point material at the joint parts which become of T type and heating the same at the specified bonding temperature.
CONSTITUTION: All divided members 1, 2 are assembled and materials 3, 3' are placed at the respective bonding parts of blades 1a and member 2, i.e., roots. It is necessary that the materials 3, 3' are lower in melting point than the bonding members. In an assembled state, these are held at the temperature lower than the melting temperature of the bonding members, then the materials 3, 3' melt at the bonding parts and deposit thereon. Radii are formed in the bonding parts owing to surface tension. It is desirable that the atmosphere be an inert gas atmosphere.
COPYRIGHT: (C)1980,JPO&Japio
JP298379A 1979-01-17 1979-01-17 Diffusion-bonding method Pending JPS5597887A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP298379A JPS5597887A (en) 1979-01-17 1979-01-17 Diffusion-bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP298379A JPS5597887A (en) 1979-01-17 1979-01-17 Diffusion-bonding method

Publications (1)

Publication Number Publication Date
JPS5597887A true JPS5597887A (en) 1980-07-25

Family

ID=11544597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP298379A Pending JPS5597887A (en) 1979-01-17 1979-01-17 Diffusion-bonding method

Country Status (1)

Country Link
JP (1) JPS5597887A (en)

Similar Documents

Publication Publication Date Title
CA1245953A (en) Soldering device, flux and method
CA2257774A1 (en) Melting of reactive metallic materials
JPS553384A (en) Method of adhering siliconndenatured silicon carbide element
JPS5597887A (en) Diffusion-bonding method
DK48475A (en) PROCEDURE FOR MIXING A CONTINUOUS FLOWING MASS IN BAG, CREAM OR PASTE FORM WITH A GAS AND A PROCEDURE FOR PERFORMING THE PROCESS
JPS5524739A (en) Steel welding method
JPS57184574A (en) Diffusion brazing method for al or al alloy
JPS5523607A (en) Crystal oscillator
JPS56139277A (en) In-furnace brazing method
JPS5633168A (en) Brazing method for copper or copper alloy
JPS55114482A (en) Bonding method of heat-resistant alloy
JPS5399071A (en) Removing apparatus of exhaust gas
EP0374689A3 (en) High temperature superconductor materials and method for preparation
JPS5220918A (en) Continuous alloy melting apparatus
JPS5440073A (en) Film forming method
JPS539477A (en) Production of semiconductor wafer laminated body
JPS56116804A (en) Method of bonding sintered body to metal member
Sluis High Temperature Brazing
JPS53112242A (en) Soldering method
JPS55114452A (en) Casting method of gas turbine blade
JPS53136480A (en) Brazing method
JPS53124143A (en) Electric welding method
Peereboom When and Why High Temperature Soldering?
KR920009502A (en) Diamond welding method
JPS54133071A (en) Manufacture for semiconductor device