JPS6437474A - Bonding of sintered boron nitride of cubic system - Google Patents
Bonding of sintered boron nitride of cubic systemInfo
- Publication number
- JPS6437474A JPS6437474A JP19128587A JP19128587A JPS6437474A JP S6437474 A JPS6437474 A JP S6437474A JP 19128587 A JP19128587 A JP 19128587A JP 19128587 A JP19128587 A JP 19128587A JP S6437474 A JPS6437474 A JP S6437474A
- Authority
- JP
- Japan
- Prior art keywords
- cubic system
- sintered boron
- films
- alloy
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Products (AREA)
Abstract
PURPOSE:To firmly bond sintered boron nitrides of cubic system at a relatively low temperature without using a solder material, by successively forming Ti films and Cu films having given thickness on joint faces of a pair of sintered boron nitrides of cubic system, sandwiching an alloy foil of three components consisting of Ag, Cu and In in between the joint faces and heating to a specific temperature. CONSTITUTION:Ti films having 0.01-1mum thickness are formed on joint faces of a pair of sintered boron nitrides of cubic system by sputtering method and then Cu films having 0.01-5mum thickness are formed. Then an alloy foil of three components having 10-1,000mum thickness, consisting of Ag, Cu and In, is sandwiched in between the joint faces and heated in vacuum or in an inert gas atmosphere at >= the melting point of the alloy of three components consisting of Ag, Cu and In and <=750 deg.C to mutually bond the sintered boron nitrides of cubic system. An alloy consisting of 15-25wt.% In, 25-35wt.% Cu and the rest of Ag is preferable as the alloy of three components.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62191285A JP2557400B2 (en) | 1987-07-30 | 1987-07-30 | Bonding method for cubic boron nitride sintered body |
EP19880112070 EP0301492B1 (en) | 1987-07-29 | 1988-07-26 | Method for bonding cubic boron nitride sintered compact |
DE8888112070T DE3868451D1 (en) | 1987-07-29 | 1988-07-26 | METHOD FOR CONNECTING A SINTER BODY OF CUBIC BORNITRIDE. |
US07/224,930 US4859531A (en) | 1987-07-29 | 1988-07-27 | Method for bonding a cubic boron nitride sintered compact |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62191285A JP2557400B2 (en) | 1987-07-30 | 1987-07-30 | Bonding method for cubic boron nitride sintered body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6437474A true JPS6437474A (en) | 1989-02-08 |
JP2557400B2 JP2557400B2 (en) | 1996-11-27 |
Family
ID=16272021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62191285A Expired - Fee Related JP2557400B2 (en) | 1987-07-29 | 1987-07-30 | Bonding method for cubic boron nitride sintered body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2557400B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5678955B2 (en) | 2010-04-08 | 2015-03-04 | 株式会社タンガロイ | Complex |
-
1987
- 1987-07-30 JP JP62191285A patent/JP2557400B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2557400B2 (en) | 1996-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |