JPS6437474A - Bonding of sintered boron nitride of cubic system - Google Patents

Bonding of sintered boron nitride of cubic system

Info

Publication number
JPS6437474A
JPS6437474A JP19128587A JP19128587A JPS6437474A JP S6437474 A JPS6437474 A JP S6437474A JP 19128587 A JP19128587 A JP 19128587A JP 19128587 A JP19128587 A JP 19128587A JP S6437474 A JPS6437474 A JP S6437474A
Authority
JP
Japan
Prior art keywords
cubic system
sintered boron
films
alloy
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19128587A
Other languages
Japanese (ja)
Other versions
JP2557400B2 (en
Inventor
Kazuo Tsuji
Hitoshi Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62191285A priority Critical patent/JP2557400B2/en
Priority to EP19880112070 priority patent/EP0301492B1/en
Priority to DE8888112070T priority patent/DE3868451D1/en
Priority to US07/224,930 priority patent/US4859531A/en
Publication of JPS6437474A publication Critical patent/JPS6437474A/en
Application granted granted Critical
Publication of JP2557400B2 publication Critical patent/JP2557400B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Ceramic Products (AREA)

Abstract

PURPOSE:To firmly bond sintered boron nitrides of cubic system at a relatively low temperature without using a solder material, by successively forming Ti films and Cu films having given thickness on joint faces of a pair of sintered boron nitrides of cubic system, sandwiching an alloy foil of three components consisting of Ag, Cu and In in between the joint faces and heating to a specific temperature. CONSTITUTION:Ti films having 0.01-1mum thickness are formed on joint faces of a pair of sintered boron nitrides of cubic system by sputtering method and then Cu films having 0.01-5mum thickness are formed. Then an alloy foil of three components having 10-1,000mum thickness, consisting of Ag, Cu and In, is sandwiched in between the joint faces and heated in vacuum or in an inert gas atmosphere at >= the melting point of the alloy of three components consisting of Ag, Cu and In and <=750 deg.C to mutually bond the sintered boron nitrides of cubic system. An alloy consisting of 15-25wt.% In, 25-35wt.% Cu and the rest of Ag is preferable as the alloy of three components.
JP62191285A 1987-07-29 1987-07-30 Bonding method for cubic boron nitride sintered body Expired - Fee Related JP2557400B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62191285A JP2557400B2 (en) 1987-07-30 1987-07-30 Bonding method for cubic boron nitride sintered body
EP19880112070 EP0301492B1 (en) 1987-07-29 1988-07-26 Method for bonding cubic boron nitride sintered compact
DE8888112070T DE3868451D1 (en) 1987-07-29 1988-07-26 METHOD FOR CONNECTING A SINTER BODY OF CUBIC BORNITRIDE.
US07/224,930 US4859531A (en) 1987-07-29 1988-07-27 Method for bonding a cubic boron nitride sintered compact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62191285A JP2557400B2 (en) 1987-07-30 1987-07-30 Bonding method for cubic boron nitride sintered body

Publications (2)

Publication Number Publication Date
JPS6437474A true JPS6437474A (en) 1989-02-08
JP2557400B2 JP2557400B2 (en) 1996-11-27

Family

ID=16272021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62191285A Expired - Fee Related JP2557400B2 (en) 1987-07-29 1987-07-30 Bonding method for cubic boron nitride sintered body

Country Status (1)

Country Link
JP (1) JP2557400B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5678955B2 (en) 2010-04-08 2015-03-04 株式会社タンガロイ Complex

Also Published As

Publication number Publication date
JP2557400B2 (en) 1996-11-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees