Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Aichi Steel Corp
Original Assignee
Toyota Central R&D Labs Inc
Aichi Steel Corp
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Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc, Aichi Steel CorpfiledCriticalToyota Central R&D Labs Inc
Priority to JP20893087ApriorityCriticalpatent/JPS6452060A/en
Publication of JPS6452060ApublicationCriticalpatent/JPS6452060A/en
PURPOSE:To obtain a metal laminate having superior adhesion between the constituent Al (alloy) and metal layer and easily undergoing soldering and other processing, by interposing a bonding layer of a metal contg. In between an easily solderable metal layer and Al (alloy). CONSTITUTION:A bonding layer of In or In and one or more among Ni, Co, Cr, Fe, Ti and Al is formed on Al (alloy). The thickness of the bonding layer is regulated to 0.005-0.5mum. A metal (alloy) layer of one or more among Ni, Co, Cr, Fe and Ti is then formed on the bonding layer. The thickness of the metal (alloy) layer is regulated to 0.05-20mum.
JP20893087A1987-08-211987-08-21Metal laminate and production thereof
PendingJPS6452060A
(en)