JPS6424078A - Method for joining ceramic to metal - Google Patents

Method for joining ceramic to metal

Info

Publication number
JPS6424078A
JPS6424078A JP17714887A JP17714887A JPS6424078A JP S6424078 A JPS6424078 A JP S6424078A JP 17714887 A JP17714887 A JP 17714887A JP 17714887 A JP17714887 A JP 17714887A JP S6424078 A JPS6424078 A JP S6424078A
Authority
JP
Japan
Prior art keywords
metal
plate
brazing
ceramic
ceramic member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17714887A
Other languages
Japanese (ja)
Inventor
Takashi Tanaka
Yutaka Morimoto
Hiroyuki Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP17714887A priority Critical patent/JPS6424078A/en
Publication of JPS6424078A publication Critical patent/JPS6424078A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE:To easily join a ceramic member to a metal member with high strength by interposing a Ti-based active metal plate between the members, putting an Ag-Cu brazing metal contg. no active metal between the plate and the ceramic member and between the plate and the metal member and carrying out brazing. CONSTITUTION:A Ti and/or Zr-based active metal plate as an insert material is interposed between a ceramic member and a metal member. An Ag-Cu brazing metal contg. practically no active metal is put between the plate and the ceramic member and between the plate and the metal member and brazing is carried out. A member of Al2O3 or silicon nitride may be used as the ceramic member and the metal of the metal member may be any metal wettable with silver solder. The thickness of the active metal plate is regulated to 0.1-0.5mm.
JP17714887A 1987-07-17 1987-07-17 Method for joining ceramic to metal Pending JPS6424078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17714887A JPS6424078A (en) 1987-07-17 1987-07-17 Method for joining ceramic to metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17714887A JPS6424078A (en) 1987-07-17 1987-07-17 Method for joining ceramic to metal

Publications (1)

Publication Number Publication Date
JPS6424078A true JPS6424078A (en) 1989-01-26

Family

ID=16026030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17714887A Pending JPS6424078A (en) 1987-07-17 1987-07-17 Method for joining ceramic to metal

Country Status (1)

Country Link
JP (1) JPS6424078A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JPH05163077A (en) * 1991-12-16 1993-06-29 Denki Kagaku Kogyo Kk Ceramic circuit board
JP2594475B2 (en) * 1990-04-16 1997-03-26 電気化学工業株式会社 Ceramic circuit board
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
US5354415A (en) * 1990-04-16 1994-10-11 Denki Kagaku Kogyo Kabushiki Kaisha Method for forming a ceramic circuit board
JP2594475B2 (en) * 1990-04-16 1997-03-26 電気化学工業株式会社 Ceramic circuit board
EP0480038B1 (en) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board
JPH05163077A (en) * 1991-12-16 1993-06-29 Denki Kagaku Kogyo Kk Ceramic circuit board

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