JPS6442370A - Method for joining ceramics and metal - Google Patents

Method for joining ceramics and metal

Info

Publication number
JPS6442370A
JPS6442370A JP19729687A JP19729687A JPS6442370A JP S6442370 A JPS6442370 A JP S6442370A JP 19729687 A JP19729687 A JP 19729687A JP 19729687 A JP19729687 A JP 19729687A JP S6442370 A JPS6442370 A JP S6442370A
Authority
JP
Japan
Prior art keywords
joining
ceramics
alloy
metal
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19729687A
Other languages
Japanese (ja)
Other versions
JP2760987B2 (en
Inventor
Masako Nakabashi
Makoto Shirokane
Hiromitsu Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62197296A priority Critical patent/JP2760987B2/en
Publication of JPS6442370A publication Critical patent/JPS6442370A/en
Application granted granted Critical
Publication of JP2760987B2 publication Critical patent/JP2760987B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To join ceramics and metal with superior adhesion by providing the joining layer containing an active metal and solder between a first body to be joined of ceramics and a second body to be joined of a specified iron-base alloy, and then heating the obtained composition. CONSTITUTION:The second body 2 to be joined 2 is obtained by forming a coated layer consisting of Cu, Cr, etc., of 1-100mum thickness, by a metal plating process, on the joining plane of an iron-base alloy such as Fe-Ni alloy, Fe-Cr alloy and Fe-Ni-Co alloy, etc. The above-mentioned joining body 2 is arranged to face the first joining body 1 consisting of an oxide ceramics such as Al2O3 or non-oxide ceramics such as AlN and other ceramics. A joining layer (e.g.; Ag solder) 5, consisting of the active metal of 1-50mum particle size and solder, is provided on the facing region of the joining bodies 1 and 2, and the obtained composition is then heated to join both bodies 1 and 2 at 700-900 deg.C, preferably in vacuum, for 1-30min.
JP62197296A 1987-08-08 1987-08-08 Joining method of ceramics and metal Expired - Fee Related JP2760987B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62197296A JP2760987B2 (en) 1987-08-08 1987-08-08 Joining method of ceramics and metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62197296A JP2760987B2 (en) 1987-08-08 1987-08-08 Joining method of ceramics and metal

Publications (2)

Publication Number Publication Date
JPS6442370A true JPS6442370A (en) 1989-02-14
JP2760987B2 JP2760987B2 (en) 1998-06-04

Family

ID=16372101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62197296A Expired - Fee Related JP2760987B2 (en) 1987-08-08 1987-08-08 Joining method of ceramics and metal

Country Status (1)

Country Link
JP (1) JP2760987B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0360414A (en) * 1989-07-27 1991-03-15 Toru Yoshida Method for joining carbon material, joined body by this method and material using the same
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JP2594475B2 (en) * 1990-04-16 1997-03-26 電気化学工業株式会社 Ceramic circuit board
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board
US7398912B2 (en) 2002-12-26 2008-07-15 Ngk Insulators, Ltd. Different materials bonded member and production method thereof
JP2015030658A (en) * 2013-08-07 2015-02-16 京セラ株式会社 Joint body of ceramic body with metal body and method for joining ceramic body with metal body
JP2016141572A (en) * 2015-01-29 2016-08-08 京セラ株式会社 Junction between ceramic and metal, and method for joining ceramic to metal
JP2017081797A (en) * 2015-10-29 2017-05-18 京セラ株式会社 Sample holder
CN110394522A (en) * 2019-08-12 2019-11-01 河北工业大学 A kind of deformation nickel-base alloy and casting Ni3The soldering processes of Al based alloy
CN115106675A (en) * 2022-08-09 2022-09-27 哈尔滨工业大学（威海） High-entropy brazing filler metal, preparation method thereof and application thereof in brazing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57129882A (en) * 1981-01-30 1982-08-12 Tochigi Koseki Kk Method of melt bonding inorganic material and metal
JPS60200868A (en) * 1984-03-22 1985-10-11 東京工業大学長 Method of bonding silicon carbide or silicon nitride sintered body
JPS61136970A (en) * 1984-12-04 1986-06-24 アメリカ合衆国 Method of soldering metal to ceramic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57129882A (en) * 1981-01-30 1982-08-12 Tochigi Koseki Kk Method of melt bonding inorganic material and metal
JPS60200868A (en) * 1984-03-22 1985-10-11 東京工業大学長 Method of bonding silicon carbide or silicon nitride sintered body
JPS61136970A (en) * 1984-12-04 1986-06-24 アメリカ合衆国 Method of soldering metal to ceramic

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0360414A (en) * 1989-07-27 1991-03-15 Toru Yoshida Method for joining carbon material, joined body by this method and material using the same
EP0480038A1 (en) * 1990-04-16 1992-04-15 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
US5354415A (en) * 1990-04-16 1994-10-11 Denki Kagaku Kogyo Kabushiki Kaisha Method for forming a ceramic circuit board
JP2594475B2 (en) * 1990-04-16 1997-03-26 電気化学工業株式会社 Ceramic circuit board
EP0480038B1 (en) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board
US7398912B2 (en) 2002-12-26 2008-07-15 Ngk Insulators, Ltd. Different materials bonded member and production method thereof
US7758970B2 (en) 2002-12-26 2010-07-20 Ngk Insulators, Ltd. Different materials bonded member and production method thereof
JP2015030658A (en) * 2013-08-07 2015-02-16 京セラ株式会社 Joint body of ceramic body with metal body and method for joining ceramic body with metal body
JP2016141572A (en) * 2015-01-29 2016-08-08 京セラ株式会社 Junction between ceramic and metal, and method for joining ceramic to metal
JP2017081797A (en) * 2015-10-29 2017-05-18 京セラ株式会社 Sample holder
CN110394522A (en) * 2019-08-12 2019-11-01 河北工业大学 A kind of deformation nickel-base alloy and casting Ni3The soldering processes of Al based alloy
CN115106675A (en) * 2022-08-09 2022-09-27 哈尔滨工业大学（威海） High-entropy brazing filler metal, preparation method thereof and application thereof in brazing
CN115106675B (en) * 2022-08-09 2024-02-27 哈尔滨工业大学（威海） High-entropy brazing filler metal, preparation method thereof and application thereof in brazing

Also Published As

Publication number Publication date
JP2760987B2 (en) 1998-06-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees