JPH0560662B2 - - Google Patents

Info

Publication number
JPH0560662B2
JPH0560662B2 JP61113006A JP11300686A JPH0560662B2 JP H0560662 B2 JPH0560662 B2 JP H0560662B2 JP 61113006 A JP61113006 A JP 61113006A JP 11300686 A JP11300686 A JP 11300686A JP H0560662 B2 JPH0560662 B2 JP H0560662B2
Authority
JP
Japan
Prior art keywords
semiconductor element
conductive member
resin layer
layer
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61113006A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62268150A (ja
Inventor
Ryuichiro Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61113006A priority Critical patent/JPS62268150A/ja
Publication of JPS62268150A publication Critical patent/JPS62268150A/ja
Publication of JPH0560662B2 publication Critical patent/JPH0560662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP61113006A 1986-05-15 1986-05-15 半導体装置 Granted JPS62268150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61113006A JPS62268150A (ja) 1986-05-15 1986-05-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61113006A JPS62268150A (ja) 1986-05-15 1986-05-15 半導体装置

Publications (2)

Publication Number Publication Date
JPS62268150A JPS62268150A (ja) 1987-11-20
JPH0560662B2 true JPH0560662B2 (enExample) 1993-09-02

Family

ID=14601074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61113006A Granted JPS62268150A (ja) 1986-05-15 1986-05-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS62268150A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382950U (enExample) * 1986-11-17 1988-05-31

Also Published As

Publication number Publication date
JPS62268150A (ja) 1987-11-20

Similar Documents

Publication Publication Date Title
US5331200A (en) Lead-on-chip inner lead bonding lead frame method and apparatus
KR890007410A (ko) 반도체 장치
JPH0383368A (ja) 半導体装置
JPH04307943A (ja) 半導体装置
JPH0560662B2 (enExample)
JPH0521698A (ja) 半導体装置
JP2562773Y2 (ja) 半導体集積回路素子
JPS59115653U (ja) 絶縁物封止半導体装置
JP3248117B2 (ja) 半導体装置
JPH06103731B2 (ja) 半導体パッケ−ジ
JPH03101256A (ja) 半導体装置
JP2507855B2 (ja) 半導体装置
JPS60235443A (ja) 半導体装置
JPS58192335A (ja) 半導体装置
JP2626631B2 (ja) 半導体装置
JPH04346256A (ja) 半導体装置
JPH05190735A (ja) 半導体装置
JPS5823469A (ja) 複合パワ−トランジスタ
JPS62123744A (ja) 半導体装置
JP2514430Y2 (ja) ハイブリッドｉｃ
JPS63310155A (ja) 半導体集積回路装置
JPH02166743A (ja) 半導体集積回路装置
JPH03227041A (ja) 樹脂封止型半導体装置
JPH04336454A (ja) 半導体装置
JPH01251644A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term