JPH0556018B2 - - Google Patents

Info

Publication number
JPH0556018B2
JPH0556018B2 JP58075600A JP7560083A JPH0556018B2 JP H0556018 B2 JPH0556018 B2 JP H0556018B2 JP 58075600 A JP58075600 A JP 58075600A JP 7560083 A JP7560083 A JP 7560083A JP H0556018 B2 JPH0556018 B2 JP H0556018B2
Authority
JP
Japan
Prior art keywords
resin
type phenolic
epoxy resin
minutes
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58075600A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59200443A (ja
Inventor
Takashi Urano
Etsuji Kubo
Shinsuke Hagiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP58075600A priority Critical patent/JPS59200443A/ja
Publication of JPS59200443A publication Critical patent/JPS59200443A/ja
Publication of JPH0556018B2 publication Critical patent/JPH0556018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP58075600A 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物 Granted JPS59200443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58075600A JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58075600A JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59200443A JPS59200443A (ja) 1984-11-13
JPH0556018B2 true JPH0556018B2 (en, 2012) 1993-08-18

Family

ID=13580853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58075600A Granted JPS59200443A (ja) 1983-04-27 1983-04-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59200443A (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152725A (ja) * 1984-12-26 1986-07-11 Sumitomo Bakelite Co Ltd フエノ−ル樹脂成形材料
JP2568584B2 (ja) * 1987-10-15 1997-01-08 日東電工株式会社 半導体装置

Also Published As

Publication number Publication date
JPS59200443A (ja) 1984-11-13

Similar Documents

Publication Publication Date Title
JP5170493B2 (ja) フェノール系重合体、その製法及びその用途
US4368299A (en) Epoxy resin compositions
JP4264769B2 (ja) エポキシ樹脂組成物及び半導体封止材料
JPH0556018B2 (en, 2012)
JP3915938B2 (ja) エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料
KR0180034B1 (ko) 반도체 캡슐화용 에폭시 수지조성물
JP3770343B2 (ja) エポキシ樹脂組成物及び半導体封止材料
JPH08100049A (ja) 半導体封止材料用エポキシ樹脂組成物
JPH08169939A (ja) 半導体封止用に適したエポキシ樹脂組成物
JP2001064362A (ja) エポキシ樹脂組成物及び半導体装置
JPS6181427A (ja) エポキシ樹脂組成物
JP3118494B2 (ja) エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JPH05287053A (ja) エポキシ樹脂、樹脂組成物及び硬化物
JP3235672B2 (ja) 電子部品用エポキシ樹脂組成物
JPH0270721A (ja) 封止材料用エポキシ樹脂組成物
JP4639412B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2948056B2 (ja) 半導体封止用樹脂組成物
JPH07216052A (ja) エポキシ樹脂及びエポキシ樹脂組成物
JPS61221219A (ja) 半導体装置封止用エポキシ樹脂組成物
JP2005179453A (ja) エポキシ樹脂及びその製造方法
JPH01121354A (ja) 封止材料用エポキシ樹脂組成物
JPH0337221A (ja) 半導体封止用エポキシ樹脂組成物
JPS59227873A (ja) 多価フエノ−ルのグリシジルエ−テルの製造法
JPH05105802A (ja) 熱硬化性樹脂組成物及びその硬化物
JP2006117790A (ja) インドール骨格含有樹脂、エポキシ樹脂組成物及びその硬化物